AM2940XC vs AM2942DMB feature comparison

AM2940XC AMD

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AM2942DMB AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DIE DIP
Package Description DIE, DIE OR CHIP DIP,
Pin Count 28 22
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 17 MHz 17 MHz
External Data Bus Width 8 8
JESD-30 Code R-XUUC-N28 R-GDIP-T22
Number of Terminals 28 22
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 290 mA 285 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR
Base Number Matches 1 1
Rohs Code No
ECCN Code 3A001.A.2.C
JESD-609 Code e0
Length 27.559 mm
Seated Height-Max 5.715 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 10.16 mm

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