AM2940XC vs AM2940FMB feature comparison

AM2940XC AMD

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AM2940FMB Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code DIE
Package Description DIE, DIE OR CHIP DFP,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 17 MHz 16 MHz
External Data Bus Width 8 8
JESD-30 Code R-XUUC-N28 R-CDFP-F28
Number of Terminals 28 28
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DFP
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP FLATPACK
Qualification Status Not Qualified
Supply Current-Max 290 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD FLAT
Terminal Position UPPER DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Length 17.9705 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.921 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 16.256 mm

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