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ZSSC3170EA1B
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ZSSC3170EA1B-ND
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Renesas Electronics Corporation | WAFER (UNSAWN) - BOX Lead time: 26 Weeks Container: Tray ZSSC3170EA1B Part Details | Temporarily Out of Stock | Buy Now ZSSC3170EA1B Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
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ZSSC3170EA1B
DISTI #
ZSSC3170EA1B
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Renesas Electronics Corporation | Automotive Sensor Signal Conditioner with LIN and PWM Interface -40 to 125°C Die Unsawn on Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSSC3170EA1B) RoHS: Compliant Min Qty: 2300 Package Multiple: 2300 Container: Waffle Pack ZSSC3170EA1B Part Details | 0 | RFQ ZSSC3170EA1B Part Details |