Findchips: Parametric Search Results for zss-113-06-s-d-1040 with 1040096X1 Organization

Parametric results for: zss-113-06-s-d-1040 under EEPROMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		XC17S150AVO8C AMD Xilinx
		XC17S150ASO20C AMD Xilinx
		XC17S150ASOG20C AMD Xilinx
		XC17S150APD8I AMD Xilinx
		XC17S150AVOG8I AMD Xilinx
		XC17S150APDG8C AMD Xilinx
		XC17S150APD8C AMD Xilinx
		XC17S150ASOG20I AMD Xilinx
		XC17S150APDG8I AMD Xilinx
		XC17S150AVOG8C AMD Xilinx

				Most Relevant				Technical														Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G8

Not Qualified

70 °C

225

PLASTIC/EPOXY

TSOP2

SOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

1.2 mm

4.9 mm

3.9 mm

XILINX INC

TSOP

PLASTIC, TSOP-8

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G20

Not Qualified

70 °C

225

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

2.65 mm

12.8 mm

7.5 mm

XILINX INC

SOIC

PLASTIC, SOIC-20

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G20

Not Qualified

70 °C

260

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

2.65 mm

12.8 mm

7.5 mm

XILINX INC

SOIC

SOP,

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDIP-T8

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

not_compliant

EAR99

8542.32.00.61

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

1.2 mm

4.9 mm

3.9 mm

XILINX INC

TSOP

TSOP2,

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

250

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Matte Tin (Sn)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

DIP,

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

225

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

not_compliant

EAR99

8542.32.00.61

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDSO-G20

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

2.65 mm

12.8 mm

7.5 mm

XILINX INC

SOIC

SOP,

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDIP-T8

Not Qualified

85 °C

-40 °C

250

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Matte Tin (Sn)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

DIP,

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G8

Not Qualified

70 °C

260

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

1.2 mm

4.9 mm

3.9 mm

XILINX INC

TSOP

TSOP2,

compliant

EAR99

8542.32.00.51

1 2 Next

Compare

XC17S150AVO8C

AMD Xilinx

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G8

Not Qualified

70 °C

225

PLASTIC/EPOXY

TSOP2

SOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

1.2 mm

4.9 mm

3.9 mm

XILINX INC

TSOP

PLASTIC, TSOP-8

not_compliant

EAR99

8542.32.00.51

XC17S150ASO20C

AMD Xilinx

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G20

Not Qualified

70 °C

225

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

2.65 mm

12.8 mm

7.5 mm

XILINX INC

SOIC

PLASTIC, SOIC-20

not_compliant

EAR99

8542.32.00.51

XC17S150ASOG20C

AMD Xilinx

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G20

Not Qualified

70 °C

260

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

2.65 mm

12.8 mm

7.5 mm

XILINX INC

SOIC

SOP,

compliant

EAR99

8542.32.00.51

XC17S150APD8I

AMD Xilinx

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDIP-T8

Not Qualified

85 °C

-40 °C

225

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

not_compliant

EAR99

8542.32.00.61

XC17S150AVOG8I

AMD Xilinx

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDSO-G8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

1.2 mm

4.9 mm

3.9 mm

XILINX INC

TSOP

TSOP2,

compliant

EAR99

8542.32.00.51

XC17S150APDG8C

AMD Xilinx

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

250

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Matte Tin (Sn)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

DIP,

compliant

EAR99

8542.32.00.51

XC17S150APD8C

AMD Xilinx

Check for Price

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

COMMON

1040096

1.0401 M

SYNCHRONOUS

3-STATE

SERIAL

50 µA

5 µA

3.6 V

3 V

CMOS

COMMERCIAL

R-PDIP-T8

Not Qualified

70 °C

225

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

PLASTIC, DIP-8

not_compliant

EAR99

8542.32.00.61

XC17S150ASOG20I

AMD Xilinx

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDSO-G20

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

2.65 mm

12.8 mm

7.5 mm

XILINX INC

SOIC

SOP,

compliant

EAR99

8542.32.00.51

XC17S150APDG8I

AMD Xilinx

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

INDUSTRIAL

R-PDIP-T8

Not Qualified

85 °C

-40 °C

250

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Matte Tin (Sn)

THROUGH-HOLE

2.54 mm

DUAL

4.5974 mm

9.3599 mm

7.62 mm

XILINX INC

DIP

DIP,

compliant

EAR99

8542.32.00.51

XC17S150AVOG8C

AMD Xilinx

Check for Price

Yes

Obsolete

1.0401 Mbit

1040096X1

3.3 V

CONFIGURATION MEMORY

1040096

1.0401 M

SYNCHRONOUS

SERIAL

3.6 V

3 V

CMOS

COMMERCIAL

R-PDSO-G8

Not Qualified

70 °C

260

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

1.2 mm

4.9 mm

3.9 mm

XILINX INC

TSOP

TSOP2,

compliant

EAR99

8542.32.00.51

1 2 Next