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Manufacturer Part Number: xc17s30
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XC17S30XLPDG8C
 AMD Xilinx 		Check for Price Yes Obsolete 249.168 kbit 1 249168X1 3.3 V 10 MHz MEMORY CIRCUIT COMMON 1 249168 249.168 k SYNCHRONOUS 3-STATE 50 µA 5 µA 3.6 V 3 V CMOS COMMERCIAL R-PDIP-T8 Not Qualified e3 1 70 °C 250 30 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP ROHS COMPLIANT, PLASTIC, DIP-8 8 unknown EAR99 8542.32.00.71
XC17S30AVO8I
 AMD Xilinx 		Check for Price No No Obsolete 336.768 kbit 1 336768X1 3.3 V CONFIGURATION MEMORY COMMON 1 336768 336.768 k SYNCHRONOUS 3-STATE SERIAL 50 µA 5 µA 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e0 3 85 °C -40 °C 225 30 8 PLASTIC/EPOXY TSOP2 SOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 1.27 mm DUAL 1.2 mm 4.9 mm 3.9 mm XILINX INC TSOP PLASTIC, TSOP-8 8 not_compliant EAR99 8542.32.00.51
XC17S30APD8I
 AMD Xilinx 		Check for Price No No Obsolete 336.768 kbit 1 336768X1 3.3 V CONFIGURATION MEMORY COMMON 1 336768 336.768 k SYNCHRONOUS 3-STATE SERIAL 50 µA 5 µA 3.6 V 3 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e0 1 85 °C -40 °C 225 30 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn85Pb15) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP PLASTIC, DIP-8 8 not_compliant EAR99 8542.32.00.61
XC17S30APDG8C
 AMD Xilinx 		Check for Price Yes Yes Obsolete 336.768 kbit 1 336768X1 3.3 V CONFIGURATION MEMORY 1 336768 336.768 k SYNCHRONOUS SERIAL 3.6 V 3 V CMOS COMMERCIAL R-PDIP-T8 Not Qualified e3 1 70 °C 250 30 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP DIP, 8 compliant EAR99 8542.32.00.51
XC17S30ASOG20I
 AMD Xilinx 		Check for Price Yes Yes Obsolete 336.768 kbit 1 336768X1 3.3 V CONFIGURATION MEMORY 1 336768 336.768 k SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 85 °C -40 °C 260 30 20 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 2.65 mm 12.8 mm 7.5 mm XILINX INC SOIC SOP, 20 compliant EAR99 8542.32.00.51
XC17S30PDG8C
 AMD Xilinx 		Check for Price Yes Yes Obsolete 247.968 kbit 1 247968X1 5 V MEMORY CIRCUIT 1 247968 247.968 k SYNCHRONOUS 5.25 V 4.75 V CMOS COMMERCIAL R-PDIP-T8 Not Qualified e3 1 70 °C 250 30 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP DIP, 8 compliant EAR99 8542.32.00.71
XC17S30VO8I
 Rochester Electronics LLC 		Check for Price Active 247.968 kbit 1 247968X1 5 V MEMORY CIRCUIT 1 247968 247.968 k SYNCHRONOUS 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G8 COMMERCIAL e0 85 °C -40 °C 8 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 1.27 mm DUAL 1.2 mm 4.9 mm 3.9 mm ROCHESTER ELECTRONICS LLC TSOP TSOP2, 8 unknown
XC17S30AVOG8C
 AMD Xilinx 		Check for Price Yes Yes Obsolete 336.768 kbit 1 336768X1 3.3 V CONFIGURATION MEMORY 1 336768 336.768 k SYNCHRONOUS SERIAL 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G8 Not Qualified e3 3 70 °C 260 30 8 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 1.2 mm 4.9 mm 3.9 mm XILINX INC TSOP TSOP2, 8 compliant EAR99 8542.32.00.51
XC17S30XLPD8I
 AMD Xilinx 		Check for Price No Obsolete 249.168 kbit 1 249168X1 3.3 V 10 MHz MEMORY CIRCUIT COMMON 1 249168 249.168 k SYNCHRONOUS 3-STATE 50 µA 5 µA 3.6 V 3 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e0 1 85 °C -40 °C 225 30 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC DIP PLASTIC, DIP-8 8 not_compliant EAR99 8542.32.00.71
XC17S300AVQG44C
 AMD 		Check for Price Yes Active 1.8756 Mbit 1 1875648X1 3.3 V CONFIGURATION MEMORY 1 1875648 1.8756 M SYNCHRONOUS SERIAL 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G44 Not Qualified e3 3 70 °C 260 30 44 PLASTIC/EPOXY TQFP SQUARE FLATPACK, THIN PROFILE YES MATTE TIN GULL WING 800 µm QUAD 1.2 mm 10 mm 10 mm ADVANCED MICRO DEVICES INC PLASTIC, VQFP-44 compliant
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