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X28HC256DMB-12
Xicor Inc
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Check for Price | No | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 120 ns | EEPROM | 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION | NO | YES | 100 | 1000000 Write/Erase Cycles | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | 128 words | PARALLEL | 5 V | 500 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | YES | 5 ms | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.24 mm | 37.15 mm | 15.24 mm | XICOR INC | DIP, DIP28,.6 | unknown | |||||||
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X28HC256DMB-12
Intersil Corporation
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 120 ns | EEPROM | 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION | NO | YES | 100 | 1000000 Write/Erase Cycles | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 128 words | PARALLEL | 5 V | 500 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | YES | 5 ms | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 225 | MIL-STD-883 | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.92 mm | 15.24 mm | INTERSIL CORP | DIP, DIP28,.6 | not_compliant | DIP | 28 | 3A001.A.2.C | 8542.32.00.51 |