Findchips: Parametric Search Results for ws57c191c55d


Select Parts		Part Number

		WS57C191C-55D STMicroelectronics
		WS57C191C-55DMB STMicroelectronics
		WS57C191C-55D Waferscale Integration Inc
		WS57C191C-55DMB Waferscale Integration Inc

			Most Relevant					Technical															Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

30 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T24

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

STMICROELECTRONICS

DIP

0.600 INCH, CERDIP-24

not_compliant

EAR99

8542.32.00.61

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Obsolete

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

35 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

STMICROELECTRONICS

DIP

WDIP, DIP24,.6

not_compliant

3A001.A.2.C

8542.32.00.61

Check for Price

Transferred

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

30 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T24

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

WAFERSCALE INTEGRATION INC

0.300 INCH, CERDIP-24

unknown

Check for Price

Transferred

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

35 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

WAFERSCALE INTEGRATION INC

0.300 INCH, CERDIP-24

unknown

3A001.A.2.C

8542.32.00.61

Compare

WS57C191C-55D

STMicroelectronics

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

30 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T24

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

STMICROELECTRONICS

DIP

0.600 INCH, CERDIP-24

not_compliant

EAR99

8542.32.00.61

WS57C191C-55DMB

STMicroelectronics

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

35 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

STMICROELECTRONICS

DIP

WDIP, DIP24,.6

not_compliant

3A001.A.2.C

8542.32.00.61

WS57C191C-55D

Waferscale Integration Inc

Check for Price

Transferred

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

30 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T24

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

WAFERSCALE INTEGRATION INC

0.300 INCH, CERDIP-24

unknown

WS57C191C-55DMB

Waferscale Integration Inc

Check for Price

Transferred

16.384 kbit

2KX8

5 V

55 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

35 mA

35 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, GLASS-SEALED

DIP

DIP24,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.72 mm

32.135 mm

15.24 mm

WAFERSCALE INTEGRATION INC

0.300 INCH, CERDIP-24

unknown

3A001.A.2.C

8542.32.00.61

Parametric results for: ws57c191c55d under EPROMs