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Parametric results for: ws57c191b291b45 under EPROMs

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Manufacturer Part Number: ws57c191b
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5962-87650043X
 QP Semiconductor 		Check for Price Transferred 16.384 kbit 8 2KX8 5 V 45 ns UVPROM 1 2000 2.048 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS MILITARY S-CQCC-N28 Not Qualified 125 °C -55 °C 28 CERAMIC, METAL-SEALED COFIRED QCCN SQUARE CHIP CARRIER YES NO LEAD QUAD QP SEMICONDUCTOR INC QLCC QCCN, 28 unknown 3A001.A.2.C 8542.32.00.61
WS57C191B-45DMB
 Waferscale Integration Inc 		Check for Price No Obsolete 16.384 kbit 8 2KX8 5 V 45 ns UVPROM COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 35 mA 107 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC, GLASS-SEALED DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
WS57C191B-45FMB
 Waferscale Integration Inc 		Check for Price No Obsolete 16.384 kbit 8 2KX8 5 V 45 ns UVPROM COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 35 mA 107 µA 5.5 V 4.5 V CMOS MILITARY R-CDFP-F24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC, METAL-SEALED COFIRED DFP FL24,.4 RECTANGULAR FLATPACK YES TIN LEAD FLAT 1.27 mm DUAL WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
5962-8765004LX
 QP Semiconductor 		Check for Price Transferred 16.384 kbit 8 2KX8 5 V 45 ns UVPROM 1 2000 2.048 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Not Qualified 125 °C -55 °C 24 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL QP SEMICONDUCTOR INC DIP DIP, 24 unknown 3A001.A.2.C 8542.32.00.61
WS57C191B-55DMB
 Waferscale Integration Inc 		Check for Price No Obsolete 16.384 kbit 8 2KX8 5 V 55 ns UVPROM COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 35 mA 95 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC, GLASS-SEALED DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
WS57C191B-45ZMB
 Waferscale Integration Inc 		Check for Price No Obsolete 16.384 kbit 8 2KX8 5 V 45 ns UVPROM COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 35 mA 107 µA 5.5 V 4.5 V CMOS MILITARY R-CQCC-N28 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 28 CERAMIC, METAL-SEALED COFIRED QCCN LCC28,.45SQ RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
5962-87650043X
 Teledyne e2v 		Check for Price Active 16.384 kbit 8 2KX8 5 V 45 ns UVPROM 1 2000 2.048 k ASYNCHRONOUS PARALLEL 30 µA 5.5 V 4.5 V CMOS MILITARY S-CQCC-N28 Not Qualified 125 °C -55 °C 28 CERAMIC, METAL-SEALED COFIRED QCCN SQUARE CHIP CARRIER YES NO LEAD QUAD TELEDYNE E2V (UK) LTD QLCC CERAMIC, LCC-28 28 compliant 3A001.A.2.C 8542.32.00.61
5962-8765004JA
 Teledyne e2v 		Check for Price Active 16.384 kbit 8 2KX8 5 V 45 ns UVPROM COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 120 mA 120 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Qualified e0 125 °C -55 °C MIL-STD-883 24 CERAMIC, GLASS-SEALED DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL TELEDYNE E2V (UK) LTD DIP DIP, DIP24,.6 24 compliant 3A001.A.2.C 8542.32.00.61
5962-8765004KX
 Teledyne e2v 		Check for Price Active 16.384 kbit 8 2KX8 5 V 45 ns UVPROM 1 2000 2.048 k ASYNCHRONOUS PARALLEL 30 µA 5.5 V 4.5 V CMOS MILITARY R-GDFP-F24 Not Qualified 125 °C -55 °C 24 CERAMIC, GLASS-SEALED DFP RECTANGULAR FLATPACK YES FLAT DUAL TELEDYNE E2V (UK) LTD DFP CERAMIC, DFP-24 24 compliant 3A001.A.2.C 8542.32.00.61
WS57C191B-55ZMB
 Waferscale Integration Inc 		Check for Price No Obsolete 16.384 kbit 8 2KX8 5 V 55 ns UVPROM COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 13.5 V 35 mA 94.5 µA 5.5 V 4.5 V CMOS MILITARY R-CQCC-N28 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 28 CERAMIC, METAL-SEALED COFIRED QCCN LCC28,.45SQ RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD WAFERSCALE INTEGRATION INC unknown 3A001.A.2.C 8542.32.00.61
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