Findchips: Parametric Search Results for ws512k32n35g4tia


Select Parts		Part Number

		WS512K32N-35G4TIA White Electronic Designs Corp
		WS512K32N-35G4TIA Mercury Systems Inc
		WS512K32N-35G4TIA Microsemi Corporation

				Most Relevant					Technical													Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

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Transferred

16.7772 Mbit

512KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 8

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-F68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFF

SQUARE

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

QUAD

3.56 mm

39.6 mm

WHITE ELECTRONIC DESIGNS CORP

40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

unknown

Check for Price

Not Recommended

16.7772 Mbit

512KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 8

512000

524.288 k

ASYNCHRONOUS

PARALLEL

660 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-F68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFF

SQUARE

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

QUAD

3.56 mm

39.6 mm

MERCURY SYSTEMS INC

40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

16.7772 Mbit

512KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 8

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-F68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFF

SQUARE

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

QUAD

3.56 mm

39.6 mm

MICROSEMI CORP

QFF,

compliant

3A991.B.2.A

8542.32.00.41

QFP

Compare

WS512K32N-35G4TIA

White Electronic Designs Corp

Check for Price

Transferred

16.7772 Mbit

512KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 8

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-F68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFF

SQUARE

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

QUAD

3.56 mm

39.6 mm

WHITE ELECTRONIC DESIGNS CORP

40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

unknown

WS512K32N-35G4TIA

Mercury Systems Inc

Check for Price

Not Recommended

16.7772 Mbit

512KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 8

512000

524.288 k

ASYNCHRONOUS

PARALLEL

660 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-F68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFF

SQUARE

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

QUAD

3.56 mm

39.6 mm

MERCURY SYSTEMS INC

40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

compliant

3A991.B.2.A

8542.32.00.41

WS512K32N-35G4TIA

Microsemi Corporation

Check for Price

Transferred

16.7772 Mbit

512KX32

5 V

35 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 8

512000

524.288 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CQFP-F68

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QFF

SQUARE

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

QUAD

3.56 mm

39.6 mm

MICROSEMI CORP

QFF,

compliant

3A991.B.2.A

8542.32.00.41

QFP

Parametric results for: ws512k32n35g4tia under SRAMs