Findchips: Parametric Search Results for ws1m32-17hsi

Parametric results for: ws1m32-17hsi under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		WS1M32-17H2C Microsemi Corporation
		WS1M32-17H2C Mercury Systems Inc
		WS1M32-17H2CA Mercury Systems Inc
		WS1M32-17H2M Microsemi Corporation
		WS1M32-17H2I Mercury Systems Inc
		WS1M32-17H2MA Mercury Systems Inc
		WS1M32-17H2I White Electronic Designs Corp
		WS1M32-17H2C White Electronic Designs Corp
		WS1M32-17H2CA Microsemi Corporation
		WS1M32-17H2I Microsemi Corporation

				Most Relevant					Technical											Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

TIN LEAD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

TIN LEAD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

WHITE ELECTRONIC DESIGNS CORP

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

WHITE ELECTRONIC DESIGNS CORP

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

TIN LEAD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

1 2 Next

Compare

WS1M32-17H2C

Microsemi Corporation

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

WS1M32-17H2C

Mercury Systems Inc

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

WS1M32-17H2CA

Mercury Systems Inc

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

TIN LEAD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

WS1M32-17H2M

Microsemi Corporation

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A001.A.2.C

8542.32.00.41

WS1M32-17H2I

Mercury Systems Inc

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

WS1M32-17H2MA

Mercury Systems Inc

Check for Price

Obsolete

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

S-CPGA-P66

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

TIN LEAD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MERCURY SYSTEMS INC

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A001.A.2.C

8542.32.00.41

WS1M32-17H2I

White Electronic Designs Corp

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

WHITE ELECTRONIC DESIGNS CORP

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

WS1M32-17H2C

White Electronic Designs Corp

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

WHITE ELECTRONIC DESIGNS CORP

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

unknown

WS1M32-17H2CA

Microsemi Corporation

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-CPGA-P66

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

TIN LEAD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

WS1M32-17H2I

Microsemi Corporation

Check for Price

Transferred

33.5544 Mbit

1MX32

5 V

17 ns

SRAM MODULE

USER CONFIGURABLE AS 2M X 16 OR 4M X 8

1000000

1.0486 M

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P66

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

GOLD

PIN/PEG

2.54 mm

PERPENDICULAR

5.7 mm

35.2 mm

MICROSEMI CORP

PGA

1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

compliant

3A991.B.2.A

8542.32.00.41

1 2 Next