Findchips: Parametric Search Results for wedpnf8m722v-1215bm


Select Parts		Part Number

		WEDPNF8M722V-1215BM Microsemi Corporation
		WEDPNF8M722V-1215BM White Electronic Designs Corp
		WEDPNF8M722V-1215BM White Microelectronics

				Most Relevant				Technical										Compliance		Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

603.9798 Mbit

8MX72

3.3 V

MEMORY CIRCUIT

USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH

8000000

8.3886 M

SYNCHRONOUS

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B275

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

275

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.54 mm

32 mm

25 mm

MICROSEMI CORP

BGA

BGA,

275

compliant

EAR99

8542.32.00.71

Check for Price

Transferred

603.9798 Mbit

8MX72

3.3 V

MEMORY CIRCUIT

USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH

8000000

8.3886 M

SYNCHRONOUS

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B275

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

275

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.54 mm

32 mm

25 mm

WHITE ELECTRONIC DESIGNS CORP

32 X 25 MM, PLASTIC, BGA-275

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

603.9798 Mbit

8MX72

3.3 V

MEMORY CIRCUIT

FLASH IS ORGANISED AS 2M X 8 OR 1M X 16 OR 512K X 32

8000000

8.3886 M

SYNCHRONOUS

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B275

Not Qualified

125 °C

-55 °C

275

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

WHITE MICROELECTRONICS

35 X 25 MM, PLASTIC, BGA-275

unknown

EAR99

8542.32.00.71

Compare

WEDPNF8M722V-1215BM

Microsemi Corporation

Check for Price

Obsolete

603.9798 Mbit

8MX72

3.3 V

MEMORY CIRCUIT

USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH

8000000

8.3886 M

SYNCHRONOUS

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B275

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

275

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.54 mm

32 mm

25 mm

MICROSEMI CORP

BGA

BGA,

275

compliant

EAR99

8542.32.00.71

WEDPNF8M722V-1215BM

White Electronic Designs Corp

Check for Price

Transferred

603.9798 Mbit

8MX72

3.3 V

MEMORY CIRCUIT

USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH

8000000

8.3886 M

SYNCHRONOUS

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B275

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

275

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

BALL

1.27 mm

BOTTOM

2.54 mm

32 mm

25 mm

WHITE ELECTRONIC DESIGNS CORP

32 X 25 MM, PLASTIC, BGA-275

unknown

EAR99

8542.32.00.71

WEDPNF8M722V-1215BM

White Microelectronics

Check for Price

Transferred

603.9798 Mbit

8MX72

3.3 V

MEMORY CIRCUIT

FLASH IS ORGANISED AS 2M X 8 OR 1M X 16 OR 512K X 32

8000000

8.3886 M

SYNCHRONOUS

3.6 V

3 V

CMOS

MILITARY

R-PBGA-B275

Not Qualified

125 °C

-55 °C

275

PLASTIC/EPOXY

RECTANGULAR

GRID ARRAY

YES

BALL

BOTTOM

WHITE MICROELECTRONICS

35 X 25 MM, PLASTIC, BGA-275

unknown

EAR99

8542.32.00.71

Parametric results for: wedpnf8m722v-1215bm under Other Memory ICs