Findchips: Parametric Search Results for wed3c755e8mxbx

Parametric results for: wed3c755e8mxbx under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		WED3C755E8MC350BI White Electronic Designs Corp
		WED3C755E8M-300BH9M White Electronic Designs Corp
		WED3C755E8MC-300BHC Microsemi Corporation
		WED3C755E8MC-300BH9C Microsemi Corporation
		WED3C755E8MF-350BC Microsemi Corporation
		WED3C755E8MF-350BC White Electronic Designs Corp
		WED3C755E8MC350BI Microsemi Corporation
		WED3C755E8MF-300BI Microsemi Corporation
		WED3C755E8MC-300BH9I Microsemi Corporation
		WED3C755E8MF-300BC White Electronic Designs Corp

				Most Relevant							Technical										Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Transferred

350 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

INDUSTRIAL

R-CBGA-B255

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.04 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

300 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.9 V

MILITARY

R-CBGA-B255

Not Qualified

125 °C

-55 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

BGA255,16X16,50

RECTANGULAR

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

21 mm

25 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-255

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

300 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

LG-MAX;WD-MAX;SEATED HT-CALCULATED

YES

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

70 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.262 mm

21.21 mm

25.25 mm

MICROSEMI CORP

BGA-255

unknown

8542.31.00.01

Check for Price

Obsolete

300 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

LG-MAX;WD-MAX;SEATED HT-CALCULATED

YES

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

70 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.262 mm

21.21 mm

25.25 mm

MICROSEMI CORP

BGA-255

unknown

8542.31.00.01

Check for Price

Obsolete

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

MICROSEMI CORP

BGA,

compliant

3A991.A.2

8542.31.00.01

BGA

255

Check for Price

Transferred

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

Check for Price

Active

350 MHz

YES

3.3 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

3.465 V

3.135 V

INDUSTRIAL

R-CBGA-B255

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

BOTTOM

3.85 mm

MICROSEMI CORP

BGA,

unknown

BGA

255

Check for Price

Obsolete

300 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

INDUSTRIAL

R-CBGA-B255

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

MICROSEMI CORP

BGA,

compliant

3A991.A.2

8542.31.00.01

BGA

255

Check for Price

Obsolete

300 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

LG-MAX;WD-MAX;SEATED HT-CALCULATED

YES

FIXED POINT

YES

2.1 V

1.9 V

INDUSTRIAL

R-CBGA-B255

85 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.262 mm

21.21 mm

25.25 mm

MICROSEMI CORP

BGA-255

unknown

8542.31.00.01

Check for Price

Transferred

300 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

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Compare

WED3C755E8MC350BI

White Electronic Designs Corp

Check for Price

Transferred

350 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

3.465 V

3.135 V

INDUSTRIAL

R-CBGA-B255

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.04 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

WED3C755E8M-300BH9M

White Electronic Designs Corp

Check for Price

Obsolete

300 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.1 V

1.9 V

MILITARY

R-CBGA-B255

Not Qualified

125 °C

-55 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

BGA255,16X16,50

RECTANGULAR

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

21 mm

25 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-255

unknown

3A991.A.2

8542.31.00.01

WED3C755E8MC-300BHC

Microsemi Corporation

Check for Price

Obsolete

300 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

LG-MAX;WD-MAX;SEATED HT-CALCULATED

YES

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

70 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.262 mm

21.21 mm

25.25 mm

MICROSEMI CORP

BGA-255

unknown

8542.31.00.01

WED3C755E8MC-300BH9C

Microsemi Corporation

Check for Price

Obsolete

300 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

LG-MAX;WD-MAX;SEATED HT-CALCULATED

YES

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

70 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.262 mm

21.21 mm

25.25 mm

MICROSEMI CORP

BGA-255

unknown

8542.31.00.01

WED3C755E8MF-350BC

Microsemi Corporation

Check for Price

Obsolete

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

MICROSEMI CORP

BGA,

compliant

3A991.A.2

8542.31.00.01

BGA

255

WED3C755E8MF-350BC

White Electronic Designs Corp

Check for Price

Transferred

350 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

WED3C755E8MC350BI

Microsemi Corporation

Check for Price

Active

350 MHz

YES

3.3 V

MICROPROCESSOR, RISC

YES

FIXED POINT

YES

3.465 V

3.135 V

INDUSTRIAL

R-CBGA-B255

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

BOTTOM

3.85 mm

MICROSEMI CORP

BGA,

unknown

BGA

255

WED3C755E8MF-300BI

Microsemi Corporation

Check for Price

Obsolete

300 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

INDUSTRIAL

R-CBGA-B255

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

MICROSEMI CORP

BGA,

compliant

3A991.A.2

8542.31.00.01

BGA

255

WED3C755E8MC-300BH9I

Microsemi Corporation

Check for Price

Obsolete

300 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

LG-MAX;WD-MAX;SEATED HT-CALCULATED

YES

FIXED POINT

YES

2.1 V

1.9 V

INDUSTRIAL

R-CBGA-B255

85 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.262 mm

21.21 mm

25.25 mm

MICROSEMI CORP

BGA-255

unknown

8542.31.00.01

WED3C755E8MF-300BC

White Electronic Designs Corp

Check for Price

Transferred

300 MHz

66 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

2.1 V

1.9 V

COMMERCIAL

R-CBGA-B255

Not Qualified

70 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

RECTANGULAR

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.85 mm

WHITE ELECTRONIC DESIGNS CORP

21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

unknown

3A991.A.2

8542.31.00.01

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