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Select Parts | Part Number |
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W25X16VSSIG
Winbond Electronics Corp
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W25X16VZEIZ
Winbond Electronics Corp
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W25X16VZEI
Winbond Electronics Corp
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W25X16-VSSI-G
Winbond Electronics Corp
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W25X16AVDAIZ
Winbond Electronics Corp
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W25X16VZPI
Winbond Electronics Corp
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W25X16VZPIG
Winbond Electronics Corp
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W25X16VSFI
Winbond Electronics Corp
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W25X16ALZPIG
Winbond Electronics Corp
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W25X16VDAIZ
Winbond Electronics Corp
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||
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Rohs Code
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Part Life Cycle Code
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Clock Frequency-Max (fCLK) |
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JESD-30 Code
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JESD-609 Code
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Samacsys Manufacturer
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Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | SOIC | 0.208 INCH, GREEN, PLASTIC, SOIC-8 | 8 | unknown | EAR99 | 8542.32.00.51 | Winbond | |||
Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | NO LEAD | DUAL | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | SON | SON, | 8 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||
Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | NO LEAD | DUAL | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | SON | SON, | 8 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||
Yes | Obsolete | 16.7772 Mbit | 1 | 16MX1 | 3 V | 33 MHz | FLASH | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 2.7 V | 3.6 V | 2.7 V | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.283 mm | 5.283 mm | WINBOND ELECTRONICS CORP | SOIC | SOP, | 8 | unknown | ||||||||||||||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 75 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDIP-T8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 9.27 mm | 7.62 mm | WINBOND ELECTRONICS CORP | DIP | DIP-8 | 8 | unknown | EAR99 | 8542.32.00.51 | Winbond | ||||
No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | HVSON, SOLCC8,.25 | 8 | not_compliant | EAR99 | 8542.32.00.51 | ||||||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | 6 X 5 MM, GREEN, WSON-8 | 8 | unknown | EAR99 | 8542.32.00.51 | Winbond | ||||||
No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.64 mm | 10.285 mm | 7.49 mm | WINBOND ELECTRONICS CORP | SOIC | SOP, SOP16,.4 | 16 | not_compliant | EAR99 | 8542.32.00.51 | |||||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 15 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | HVSON, SOLCC8,.25 | 8 | compliant | EAR99 | 8542.32.00.51 | |||||||
Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDIP-T8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 9.27 mm | 7.62 mm | WINBOND ELECTRONICS CORP | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 8 | unknown | EAR99 | 8542.32.00.51 |
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W25X16VSSIG
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | SOIC | 0.208 INCH, GREEN, PLASTIC, SOIC-8 | 8 | unknown | EAR99 | 8542.32.00.51 | Winbond | ||||
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W25X16VZEIZ
Winbond Electronics Corp
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Check for Price | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | NO LEAD | DUAL | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | SON | SON, | 8 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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W25X16VZEI
Winbond Electronics Corp
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Check for Price | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | NO LEAD | DUAL | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | SON | SON, | 8 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||||
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W25X16-VSSI-G
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 1 | 16MX1 | 3 V | 33 MHz | FLASH | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 2.7 V | 3.6 V | 2.7 V | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.283 mm | 5.283 mm | WINBOND ELECTRONICS CORP | SOIC | SOP, | 8 | unknown | |||||||||||||||
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W25X16AVDAIZ
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 75 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDIP-T8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 9.27 mm | 7.62 mm | WINBOND ELECTRONICS CORP | DIP | DIP-8 | 8 | unknown | EAR99 | 8542.32.00.51 | Winbond | |||||
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W25X16VZPI
Winbond Electronics Corp
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Check for Price | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | HVSON, SOLCC8,.25 | 8 | not_compliant | EAR99 | 8542.32.00.51 | |||||||
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W25X16VZPIG
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | 6 X 5 MM, GREEN, WSON-8 | 8 | unknown | EAR99 | 8542.32.00.51 | Winbond | |||||||
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W25X16VSFI
Winbond Electronics Corp
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Check for Price | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 33 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.64 mm | 10.285 mm | 7.49 mm | WINBOND ELECTRONICS CORP | SOIC | SOP, SOP16,.4 | 16 | not_compliant | EAR99 | 8542.32.00.51 | ||||||
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W25X16ALZPIG
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 15 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | SON | HVSON, SOLCC8,.25 | 8 | compliant | EAR99 | 8542.32.00.51 | ||||||||
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W25X16VDAIZ
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 10 µA | 18 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDIP-T8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 9.27 mm | 7.62 mm | WINBOND ELECTRONICS CORP | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 8 | unknown | EAR99 | 8542.32.00.51 |