Parametric results for: w25x16, under Flash Memories

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33803345576880
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4.8510.314.856.2157.588.94510.31
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4 194 30416 777 2164 194 3047 340 03210 485 76013 631 48816 777 216
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1813568
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2 097 15216 777 2162 097 1525 767 1689 437 18413 107 20016 777 216
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2 000 00016 000 0002 000 0005 500 0009 000 00012 500 00016 000 000
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Manufacturer Part Number: w25x16
Select parts from the table below to compare.
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W25X16VSSIG
Winbond Electronics Corp
W25X16VZEIZ
Winbond Electronics Corp
W25X16VZEI
Winbond Electronics Corp
W25X16-VSSI-G
Winbond Electronics Corp
W25X16AVDAIZ
Winbond Electronics Corp
W25X16VZPI
Winbond Electronics Corp
W25X16VZPIG
Winbond Electronics Corp
W25X16VSFI
Winbond Electronics Corp
W25X16ALZPIG
Winbond Electronics Corp
W25X16VDAIZ
Winbond Electronics Corp
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Rohs Code
Part Life Cycle Code
Memory Density
Memory Width Organization Supply Voltage-Nom (Vsup)
Clock Frequency-Max (fCLK) Memory IC Type
Data Retention Time-Min
Endurance
Number of Functions Number of Words Code Number of Words Operating Mode
Output Characteristics
Parallel/Serial
Programming Voltage
Serial Bus Type
Standby Current-Max
Supply Current-Max
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Technology Temperature Grade
Type
Write Protection
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Surface Mount
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Length
Width
Ihs Manufacturer
Part Package Code
Package Description
Pin Count
Reach Compliance Code
ECCN Code
HTS Code
Samacsys Manufacturer
Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 18 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE S-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.3 SQUARE SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 2.16 mm 5.28 mm 5.28 mm WINBOND ELECTRONICS CORP SOIC 0.208 INCH, GREEN, PLASTIC, SOIC-8 8 unknown EAR99 8542.32.00.51 Winbond
Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SON RECTANGULAR SMALL OUTLINE YES NO LEAD DUAL 8 mm 6 mm WINBOND ELECTRONICS CORP SON SON, 8 unknown EAR99 8542.32.00.51
Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SON RECTANGULAR SMALL OUTLINE YES NO LEAD DUAL 8 mm 6 mm WINBOND ELECTRONICS CORP SON SON, 8 unknown EAR99 8542.32.00.51
Yes Obsolete 16.7772 Mbit 1 16MX1 3 V 33 MHz FLASH 1 16000000 16.7772 M SYNCHRONOUS SERIAL 2.7 V 3.6 V 2.7 V INDUSTRIAL S-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SQUARE SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 2.16 mm 5.283 mm 5.283 mm WINBOND ELECTRONICS CORP SOIC SOP, 8 unknown
Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 75 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 20 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDIP-T8 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.33 mm 9.27 mm 7.62 mm WINBOND ELECTRONICS CORP DIP DIP-8 8 unknown EAR99 8542.32.00.51 Winbond
No Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 1 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm WINBOND ELECTRONICS CORP SON HVSON, SOLCC8,.25 8 not_compliant EAR99 8542.32.00.51
Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 18 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm WINBOND ELECTRONICS CORP SON 6 X 5 MM, GREEN, WSON-8 8 unknown EAR99 8542.32.00.51 Winbond
No Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified e0 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 2.64 mm 10.285 mm 7.49 mm WINBOND ELECTRONICS CORP SOIC SOP, SOP16,.4 16 not_compliant EAR99 8542.32.00.51
Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 15 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm WINBOND ELECTRONICS CORP SON HVSON, SOLCC8,.25 8 compliant EAR99 8542.32.00.51
Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 18 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDIP-T8 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.33 mm 9.27 mm 7.62 mm WINBOND ELECTRONICS CORP DIP 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 8 unknown EAR99 8542.32.00.51
Compare
W25X16VSSIG
Winbond Electronics Corp
Check for Price Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 18 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE S-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.3 SQUARE SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 2.16 mm 5.28 mm 5.28 mm WINBOND ELECTRONICS CORP SOIC 0.208 INCH, GREEN, PLASTIC, SOIC-8 8 unknown EAR99 8542.32.00.51 Winbond
W25X16VZEIZ
Winbond Electronics Corp
Check for Price Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SON RECTANGULAR SMALL OUTLINE YES NO LEAD DUAL 8 mm 6 mm WINBOND ELECTRONICS CORP SON SON, 8 unknown EAR99 8542.32.00.51
W25X16VZEI
Winbond Electronics Corp
Check for Price Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SON RECTANGULAR SMALL OUTLINE YES NO LEAD DUAL 8 mm 6 mm WINBOND ELECTRONICS CORP SON SON, 8 unknown EAR99 8542.32.00.51
W25X16-VSSI-G
Winbond Electronics Corp
Check for Price Yes Obsolete 16.7772 Mbit 1 16MX1 3 V 33 MHz FLASH 1 16000000 16.7772 M SYNCHRONOUS SERIAL 2.7 V 3.6 V 2.7 V INDUSTRIAL S-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SQUARE SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 2.16 mm 5.283 mm 5.283 mm WINBOND ELECTRONICS CORP SOIC SOP, 8 unknown
W25X16AVDAIZ
Winbond Electronics Corp
Check for Price Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 75 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 20 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDIP-T8 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.33 mm 9.27 mm 7.62 mm WINBOND ELECTRONICS CORP DIP DIP-8 8 unknown EAR99 8542.32.00.51 Winbond
W25X16VZPI
Winbond Electronics Corp
Check for Price No Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 1 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm WINBOND ELECTRONICS CORP SON HVSON, SOLCC8,.25 8 not_compliant EAR99 8542.32.00.51
W25X16VZPIG
Winbond Electronics Corp
Check for Price Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 18 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm WINBOND ELECTRONICS CORP SON 6 X 5 MM, GREEN, WSON-8 8 unknown EAR99 8542.32.00.51 Winbond
W25X16VSFI
Winbond Electronics Corp
Check for Price No Obsolete 16.7772 Mbit 8 2MX8 3 V 33 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified e0 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 2.64 mm 10.285 mm 7.49 mm WINBOND ELECTRONICS CORP SOIC SOP, SOP16,.4 16 not_compliant EAR99 8542.32.00.51
W25X16ALZPIG
Winbond Electronics Corp
Check for Price Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 15 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 6 mm 5 mm WINBOND ELECTRONICS CORP SON HVSON, SOLCC8,.25 8 compliant EAR99 8542.32.00.51
W25X16VDAIZ
Winbond Electronics Corp
Check for Price Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 50 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 10 µA 18 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDIP-T8 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.33 mm 9.27 mm 7.62 mm WINBOND ELECTRONICS CORP DIP 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 8 unknown EAR99 8542.32.00.51