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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: tspc860srmzpu66d4 under Microprocessors

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Select Parts		Part Number

		TSPC860SRMZPU66D4 Teledyne e2v
		TSPC860SRMZPU66D4 Atmel Corporation

			Most Relevant							Technical									Compliance			Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

32

66 MHz

32

32

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

MILITARY

S-PBGA-B357

Not Qualified

125 °C

-55 °C

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

TELEDYNE E2V (UK) LTD

BGA

BGA,

357

compliant

3A991.A.2

8542.31.00.01

Check for Price

No

Transferred

32

66 MHz

32

32

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

MILITARY

S-PBGA-B357

Not Qualified

e0

125 °C

-55 °C

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

ATMEL CORP

BGA

PLASTIC, BGA-357

357

unknown

3A991.A.2

8542.31.00.01

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Microcontrollers and Processors

TSPC860SRMZPU66D4

Teledyne e2v

Check for Price

Obsolete

32

66 MHz

32

32

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

MILITARY

S-PBGA-B357

Not Qualified

125 °C

-55 °C

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

TELEDYNE E2V (UK) LTD

BGA

BGA,

357

compliant

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

TSPC860SRMZPU66D4

Atmel Corporation

Check for Price

No

Transferred

32

66 MHz

32

32

66 MHz

YES

3.3 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

3.465 V

3.135 V

MILITARY

S-PBGA-B357

Not Qualified

e0

125 °C

-55 °C

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.05 mm

25 mm

25 mm

ATMEL CORP

BGA

PLASTIC, BGA-357

357

unknown

3A991.A.2

8542.31.00.01