Parametric results for: tsg60 under Sockets and Chip Carriers

All Filters Additional Feature Contact Finish Mating Contact Finish Termination Contact Material Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Number of Contacts Part Life Cycle Code Rohs Code

UL-94V-0, BGA SOCKET 28

43 hits Apply

GOLD OVER NICKEL 28

43 hits Apply

GOLD OVER NICKEL 28

43 hits Apply

Contact Material (1)

BERYLLIUM COPPER ALLOY 28

43 hits Apply

IC SOCKET 42

43 hits Apply

BGA600 28 BGA608 14

43 hits Apply

POLYPHENYLENE SULFIDE 42

43 hits Apply

e4 28

43 hits Apply

Manufacturer (2)

Advanced Interconnections Corp 42 Taiwan Semiconductor 1

43 hits Apply

Number of Contacts (2)

600 28 608 14

Min - Max

43 hits Apply

Obsolete 43

43 hits Apply

Yes 29

43 hits Apply