Findchips: Parametric Search Results for tea1062a,

Parametric results for: tea1062a, under Telephone Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		TEA1062AN-S16-T Unisonic Technologies Co Ltd
		TEA1062ANG-S16-R Unisonic Technologies Co Ltd
		TEA1062A/C4/M1,112 NXP Semiconductors
		TEA1062AT NXP Semiconductors
		TEA1062AT/C4,118 NXP Semiconductors
		TEA1062AN NXP Semiconductors
		TEA1062A(16DIP) Unisonic Technologies Co Ltd
		TEA1062A Philips Semiconductors
		TEA1062AN-S16-R Unisonic Technologies Co Ltd
		TEA1062ATD NXP Semiconductors

				Most Relevant		Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Reach Compliance Code	HTS Code	Samacsys Manufacturer	Part Package Code	Package Description	Pin Count

Check for Price

Active

3.4 V

BIPOLAR

1.35 mA

OTHER

R-PDSO-G16

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

UTC

Check for Price

Yes

Active

3.4 V

BIPOLAR

TELEPHONE DIALER CIRCUIT

1.35 µA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.95 mm

10 mm

1.96 mm

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

SOIC

SOP, SOP16,.25

Check for Price

Yes

Active

2.7 V

TELEPHONE SPEECH CIRCUIT

COMMERCIAL EXTENDED

R-PDIP-T16

Not Qualified

75 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Nickel/Palladium/Gold (Ni/Pd/Au)

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

38.1 mm

4.32 mm

NXP SEMICONDUCTORS

compliant

8542.39.00.01

DIP

DIP,

Check for Price

Yes

Obsolete

3.4 V

BIPOLAR

TELEPHONE SPEECH CIRCUIT

1.35 mA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

260

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

9.9 mm

1.75 mm

NXP SEMICONDUCTORS

unknown

8542.39.00.01

NXP

SOIC

SOP, SOP16,.25

Check for Price

Yes

Active

2.7 V

BIPOLAR

TELEPHONE SPEECH CIRCUIT

1.35 µA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

260

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

9.9 mm

1.75 mm

NXP SEMICONDUCTORS

compliant

8542.39.00.01

NXP

SOIC

PLASTIC, SO-16

Check for Price

Yes

Obsolete

2.7 V

TELEPHONE SPEECH CIRCUIT

COMMERCIAL EXTENDED

R-PDIP-T16

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

38.1 mm

4.32 mm

NXP SEMICONDUCTORS

unknown

8542.39.00.01

NXP

DIP

0.300 INCH, PLASTIC, SOT-38, DIP-16

Check for Price

Active

3.4 V

BIPOLAR

1.35 mA

OTHER

R-PDIP-T16

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

Check for Price

Yes

Transferred

3.4 V

BIPOLAR

1.35 mA

OTHER

R-PDIP-T16

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

Matte Tin (Sn)

THROUGH-HOLE

2.54 mm

DUAL

PHILIPS SEMICONDUCTORS

unknown

8542.39.00.01

DIP, DIP16,.3

Check for Price

Active

3.4 V

BIPOLAR

TELEPHONE DIALER CIRCUIT

1.35 µA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

3.95 mm

10 mm

1.96 mm

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

SOIC

SOP-16

Check for Price

Yes

Obsolete

2.7 V

TELEPHONE SPEECH CIRCUIT

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

9.9 mm

1.75 mm

NXP SEMICONDUCTORS

unknown

8542.39.00.01

NXP

SOIC

SOP,

1 2 3 Next

Compare

TEA1062AN-S16-T

Unisonic Technologies Co Ltd

Check for Price

Active

3.4 V

BIPOLAR

1.35 mA

OTHER

R-PDSO-G16

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

UTC

TEA1062ANG-S16-R

Unisonic Technologies Co Ltd

Check for Price

Yes

Active

3.4 V

BIPOLAR

TELEPHONE DIALER CIRCUIT

1.35 µA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.95 mm

10 mm

1.96 mm

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

SOIC

SOP, SOP16,.25

TEA1062A/C4/M1,112

NXP Semiconductors

Check for Price

Yes

Active

2.7 V

TELEPHONE SPEECH CIRCUIT

COMMERCIAL EXTENDED

R-PDIP-T16

Not Qualified

75 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Nickel/Palladium/Gold (Ni/Pd/Au)

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

38.1 mm

4.32 mm

NXP SEMICONDUCTORS

compliant

8542.39.00.01

DIP

DIP,

TEA1062AT

NXP Semiconductors

Check for Price

Yes

Obsolete

3.4 V

BIPOLAR

TELEPHONE SPEECH CIRCUIT

1.35 mA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

260

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

9.9 mm

1.75 mm

NXP SEMICONDUCTORS

unknown

8542.39.00.01

NXP

SOIC

SOP, SOP16,.25

TEA1062AT/C4,118

NXP Semiconductors

Check for Price

Yes

Active

2.7 V

BIPOLAR

TELEPHONE SPEECH CIRCUIT

1.35 µA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

260

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

9.9 mm

1.75 mm

NXP SEMICONDUCTORS

compliant

8542.39.00.01

NXP

SOIC

PLASTIC, SO-16

TEA1062AN

NXP Semiconductors

Check for Price

Yes

Obsolete

2.7 V

TELEPHONE SPEECH CIRCUIT

COMMERCIAL EXTENDED

R-PDIP-T16

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

38.1 mm

4.32 mm

NXP SEMICONDUCTORS

unknown

8542.39.00.01

NXP

DIP

0.300 INCH, PLASTIC, SOT-38, DIP-16

TEA1062A(16DIP)

Unisonic Technologies Co Ltd

Check for Price

Active

3.4 V

BIPOLAR

1.35 mA

OTHER

R-PDIP-T16

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

THROUGH-HOLE

2.54 mm

DUAL

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

TEA1062A

Philips Semiconductors

Check for Price

Yes

Transferred

3.4 V

BIPOLAR

1.35 mA

OTHER

R-PDIP-T16

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

Matte Tin (Sn)

THROUGH-HOLE

2.54 mm

DUAL

PHILIPS SEMICONDUCTORS

unknown

8542.39.00.01

DIP, DIP16,.3

TEA1062AN-S16-R

Unisonic Technologies Co Ltd

Check for Price

Active

3.4 V

BIPOLAR

TELEPHONE DIALER CIRCUIT

1.35 µA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

3.95 mm

10 mm

1.96 mm

UNISONIC TECHNOLOGIES CO LTD

compliant

8542.39.00.01

SOIC

SOP-16

TEA1062ATD

NXP Semiconductors

Check for Price

Yes

Obsolete

2.7 V

TELEPHONE SPEECH CIRCUIT

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

9.9 mm

1.75 mm

NXP SEMICONDUCTORS

unknown

8542.39.00.01

NXP

SOIC

SOP,

1 2 3 Next