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SST39LF802C-55-4C-EKE-T
Microchip Technology Inc
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$3.2600 | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | YES | 20 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 70 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | ||||||||
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SST39LF802C-55-4C-MAQE
Microchip Technology Inc
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Check for Price | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | YES | 20 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X11,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 730 µm | 6 mm | 4 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | DSBGA | 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 | 48 | ||
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SST39LF802C-55-4C-MAQE-T
Microchip Technology Inc
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Check for Price | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | YES | 20 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X11,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 730 µm | 6 mm | 4 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | ||||||||
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SST39LF802C-55-4C-EKE
Microchip Technology Inc
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Check for Price | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | YES | 20 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | TSOP1 | 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP-48 | 48 | ||
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SST39LF802C-55-4C-B3KE
Microchip Technology Inc
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Check for Price | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | YES | 20 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | BGA | 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB1,TFBGA-48 | 48 | ||
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SST39LF802C-55-4C-B3KE-T
Microchip Technology Inc
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Check for Price | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | YES | 20 µA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 |