Parametric results for: sst39lf802c under Flash Memories

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Manufacturer Part Number: sst39lf802c
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SST39LF802C-55-4C-EKE-T
Microchip Technology Inc
$3.2600 Yes Active 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3.3 V 55 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 70 °C 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 Microchip
SST39LF802C-55-4C-MAQE
Microchip Technology Inc
Check for Price Yes Active 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3.3 V 55 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X11,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 730 µm 6 mm 4 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 Microchip DSBGA 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 48
SST39LF802C-55-4C-MAQE-T
Microchip Technology Inc
Check for Price Yes Active 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3.3 V 55 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 70 °C 48 PLASTIC/EPOXY FBGA BGA48,6X11,20 RECTANGULAR GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 730 µm 6 mm 4 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 Microchip
SST39LF802C-55-4C-EKE
Microchip Technology Inc
Check for Price Yes Active 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3.3 V 55 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 70 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 Microchip TSOP1 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP-48 48
SST39LF802C-55-4C-B3KE
Microchip Technology Inc
Check for Price Yes Active 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3.3 V 55 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 Microchip BGA 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB1,TFBGA-48 48
SST39LF802C-55-4C-B3KE-T
Microchip Technology Inc
Check for Price Yes Active 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3.3 V 55 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 70 °C 48 PLASTIC/EPOXY FBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 8 mm 6 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51