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SPAKXC309VF100A
Freescale Semiconductor
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Check for Price | No | No | Transferred | 24 | 18 | 100 MHz | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FIXED POINT | MULTIPLE | YES | 3.6 V | 3 V | S-PBGA-B196 | Not Qualified | e0 | 3 | 220 | 30 | 196 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 1.6 mm | 15 mm | 15 mm | FREESCALE SEMICONDUCTOR INC | BGA | 15 X 15 MM, 1 MM PITCH, MOLD ARRAY PROCESS, BGA-196 | 196 | not_compliant | 3A991.A.2 | 8542.31.00.01 | ||
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SPAKXC309VF100A
Motorola Semiconductor Products
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Check for Price | Transferred | 24 | 18 | 100 MHz | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FIXED POINT | MULTIPLE | YES | 3.6 V | 3 V | S-PBGA-B196 | Not Qualified | 196 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | BALL | 1 mm | BOTTOM | 1.6 mm | 15 mm | 15 mm | MOTOROLA INC | LBGA, | unknown | 3A991.A.2 | 8542.31.00.01 | |||||||||||
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SPAKXC309VF100A
Motorola Mobility LLC
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Check for Price | Transferred | 24 | 18 | 100 MHz | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FIXED POINT | MULTIPLE | YES | 3.6 V | 3 V | S-PBGA-B196 | Not Qualified | 196 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | BALL | 1 mm | BOTTOM | 1.6 mm | 15 mm | 15 mm | MOTOROLA INC | BGA | LBGA, | 196 | unknown | 3A991.A.2 | 8542.31.00.01 | |||||||||
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SPAKXC309VF100A
NXP Semiconductors
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Check for Price | No | Active | 24 | 18 | 100 MHz | YES | 3.3 V | DIGITAL SIGNAL PROCESSOR, OTHER | CMOS | YES | YES | FIXED POINT | MULTIPLE | YES | 3.6 V | 3 V | S-PBGA-B196 | Not Qualified | 3 | 196 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | BALL | 1 mm | BOTTOM | 1.6 mm | 15 mm | 15 mm | NXP SEMICONDUCTORS | 15 X 15 MM, 1 MM PITCH, MOLD ARRAY PROCESS, BGA-196 | compliant | 3A991.A.2 | 8542.31.00.01 |