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SC16C852SVIET,115
NXP Semiconductors
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$2.4038 | Yes | Obsolete | 8 | 8 | 0.0000012122176018 MBps | 80 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | NRZ | YES | 2 | 1.95 V | 1.65 V | INDUSTRIAL | S-PBGA-B36 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 36 | PLASTIC/EPOXY | TFBGA | BGA36,6X6,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.15 mm | 3.5 mm | 3.5 mm | NXP SEMICONDUCTORS | BGA | TFBGA, BGA36,6X6,20 | 36 | SOT912-1 | compliant | 8542.31.00.01 | NXP | ||||
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SC16C852IB
NXP Semiconductors
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Check for Price | Yes | Active | 8 | 0.625 MBps | 80 MHz | YES | 2.5 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | NRZ | YES | 2 | 2.75 V | 2.25 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | NXP SEMICONDUCTORS | QFP | 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT313-2, LQFP-48 | 48 | compliant | 8542.31.00.01 | ||||||||||
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SC16C852VIET-S
NXP Semiconductors
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Check for Price | Yes | Obsolete | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | 1.89 V | 1.71 V | INDUSTRIAL | S-PBGA-B36 | Not Qualified | 85 °C | -40 °C | 36 | PLASTIC/EPOXY | FBGA | BGA36,6X6,20 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 500 µm | BOTTOM | NXP SEMICONDUCTORS | FBGA, BGA36,6X6,20 | unknown | 8542.31.00.01 | |||||||||||||||||||||||
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SC16C852VIET,151
NXP Semiconductors
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Check for Price | Yes | Obsolete | 8 | 8 | 0.625 MBps | 80 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | NRZ | YES | 2 | 1.95 V | 1.65 V | INDUSTRIAL | S-PBGA-B36 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 36 | PLASTIC/EPOXY | TFBGA | BGA36,6X6,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.15 mm | 3.5 mm | 3.5 mm | NXP SEMICONDUCTORS | BGA | 3.50 X 3.50 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-912-1, TFBGA-36 | 36 | SOT912-1 | compliant | 8542.31.00.01 | |||||
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SC16C850LIBS-S
NXP Semiconductors
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Check for Price | Yes | Obsolete | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | 1.89 V | 1.71 V | INDUSTRIAL | S-PQCC-N32 | Not Qualified | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | QCCN, LCC32,.2SQ,20 | unknown | 8542.31.00.01 | |||||||||||||||||||||||
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SC16C852LIET,118
NXP Semiconductors
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Check for Price | Yes | Obsolete | 8 | 0.625 MBps | 80 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | NRZ | YES | 2 | 1.95 V | 1.65 V | INDUSTRIAL | S-PBGA-B36 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 36 | PLASTIC/EPOXY | TFBGA | BGA36,6X6,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.15 mm | 3.5 mm | 3.5 mm | NXP SEMICONDUCTORS | BGA | 3.50 X 3.50 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-912-1, TFBGA-36 | 36 | SOT912-1 | unknown | |||||||
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SC16C852SVIET,151
NXP Semiconductors
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Check for Price | Yes | Obsolete | 8 | 8 | 0.0000012122176018 MBps | 80 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | NRZ | YES | 2 | 1.95 V | 1.65 V | INDUSTRIAL | S-PBGA-B36 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 36 | PLASTIC/EPOXY | TFBGA | BGA36,6X6,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.15 mm | 3.5 mm | 3.5 mm | NXP SEMICONDUCTORS | BGA | TFBGA, BGA36,6X6,20 | 36 | SOT912-1 | compliant | 8542.31.00.01 | |||||
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SC16C850IBS
NXP Semiconductors
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Check for Price | Yes | Yes | Obsolete | 8 | 3 | 0.625 MBps | 80 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | CAN ALSO OPERATE AT 2.5V SUPPLY | NO | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG 3838 | YES | 1 | 3.6 V | 3 V | INDUSTRIAL | S-PQCC-N32 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | NXP SEMICONDUCTORS | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | unknown | 8542.31.00.01 | |||||
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SC16C850IBS,151
NXP Semiconductors
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Check for Price | Yes | Obsolete | 8 | 3 | 0.625 MBps | 80 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | CAN ALSO OPERATE AT 2.5V SUPPLY | NO | ASYNC, BIT | YES | 1 | 3.6 V | 3 V | INDUSTRIAL | S-PQCC-N32 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | NXP SEMICONDUCTORS | QFN | 5 X 5 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-220, SOT617-1, HVQFN-32 | 32 | SOT617-1 | unknown | ||||||
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SC16C850VIBS,115
NXP Semiconductors
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Check for Price | Yes | Obsolete | 8 | 8 | 0.625 MBps | 80 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CMOS | NO | ASYNC, BIT | YES | 1 | 1.95 V | 1.65 V | INDUSTRIAL | S-PQCC-N32 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | NXP SEMICONDUCTORS | QFN | 5 X 5 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-220, SOT-617-1, HVQFN-32 | 32 | SOT617-1 | unknown | 8542.31.00.01 |