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Manufacturer Part Number: s72ws256n
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S72WS256ND0KFWD32
 Spansion 		Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER S-PBGA-B160 Not Qualified e1 85 °C -25 °C 260 40 160 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 650 µm BOTTOM 1.25 mm 15 mm 15 mm SPANSION INC BGA LFBGA, 160 compliant EAR99 8542.32.00.71
S72WS256NDEBFWUB3
 AMD 		Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+SDRAM 40 µA 60 µA CMOS OTHER R-PBGA-B137 Not Qualified 85 °C -25 °C 137 PLASTIC/EPOXY FBGA BGA137,10X14,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA137,10X14,32 compliant EAR99 8542.32.00.71
S72WS256ND0BAWBB2
 Cypress Semiconductor 		Check for Price Active CYPRESS SEMICONDUCTOR CORP compliant
S72WS256NE0BFWBB0
 Spansion 		Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B137 Not Qualified e1 3 85 °C -25 °C 137 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC BGA TFBGA, 137 compliant EAR99 8542.32.00.71
S72WS256NEEBFWU73
 Spansion 		Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B137 Not Qualified e1 3 85 °C -25 °C 260 40 137 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 12 mm 9 mm SPANSION INC BGA LFBGA, 137 compliant EAR99 8542.32.00.71
S72WS256NEEBAWU72
 AMD 		Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+SDRAM 40 µA 60 µA CMOS OTHER R-PBGA-B137 Not Qualified 85 °C -25 °C 137 PLASTIC/EPOXY FBGA BGA137,10X14,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA137,10X14,32 compliant EAR99 8542.32.00.71
S72WS256NEEBAWU73
 AMD 		Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+SDRAM 40 µA 60 µA CMOS OTHER R-PBGA-B137 Not Qualified 85 °C -25 °C 137 PLASTIC/EPOXY FBGA BGA137,10X14,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA137,10X14,32 compliant EAR99 8542.32.00.71
S72WS256NDEBAWU72
 Spansion 		Check for Price No Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B137 Not Qualified e0 85 °C -25 °C 137 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 12 mm 9 mm SPANSION INC BGA LFBGA, 137 compliant EAR99 8542.32.00.71
S72WS256ND0BFWB72
 AMD 		Check for Price Yes Active 1.8 V 70 ns MEMORY CIRCUIT FLASH+SDRAM 40 µA 60 µA CMOS OTHER R-PBGA-B137 Not Qualified 85 °C -25 °C 137 PLASTIC/EPOXY FBGA BGA137,10X14,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA137,10X14,32 compliant EAR99 8542.32.00.71
S72WS256NE0BFWB73
 Spansion 		Check for Price Yes Obsolete 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT ... more 1 16000000 16.7772 M ASYNCHRONOUS 1.95 V 1.7 V CMOS OTHER R-PBGA-B137 Not Qualified e1 3 85 °C -25 °C 137 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 12 mm 9 mm SPANSION INC BGA TFBGA, 137 compliant EAR99 8542.32.00.71
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