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Parametric » Memory » Other Memory ICs

Parametric results for: s71pl064ja0bai05 under Other Memory ICs

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Manufacturer Part Number: s71pl064ja0bai05
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S71PL064JA0BAI052
 AMD 		Check for Price Yes Obsolete 70 ns MEMORY CIRCUIT FLASH+PSRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.71
S71PL064JA0BAI050
 Spansion 		Check for Price No Obsolete 67.1089 Mbit 16 4MX16 3 V MEMORY CIRCUIT PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16 1 4000000 4.1943 M ASYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified e0 3 85 °C -40 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.71 BGA 56
S71PL064JA0BAI050
 AMD 		Check for Price Yes Obsolete 70 ns MEMORY CIRCUIT FLASH+PSRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.71
S71PL064JA0BAI054
 AMD 		Check for Price Yes Obsolete 70 ns MEMORY CIRCUIT FLASH+PSRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.71
S71PL064JA0BAI053
 AMD 		Check for Price Yes Obsolete 70 ns MEMORY CIRCUIT FLASH+PSRAM 5 µA 70 µA CMOS INDUSTRIAL S-PBGA-B56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY FBGA BGA56,8X8,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM ADVANCED MICRO DEVICES INC FBGA, BGA56,8X8,32 compliant EAR99 8542.32.00.71
S71PL064JA0BAI054
 Spansion 		Check for Price No Obsolete 67.1089 Mbit 16 4MX16 3 V MEMORY CIRCUIT PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16 1 4000000 4.1943 M ASYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified e0 3 85 °C -40 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.71 BGA 56
S71PL064JA0BAI052
 Spansion 		Check for Price No Obsolete 67.1089 Mbit 16 4MX16 3 V MEMORY CIRCUIT PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16 1 4000000 4.1943 M ASYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified e0 3 85 °C -40 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.71 BGA 56
S71PL064JA0BAI053
 Spansion 		Check for Price No Obsolete 67.1089 Mbit 16 4MX16 3 V MEMORY CIRCUIT PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16 1 4000000 4.1943 M ASYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PBGA-B56 Not Qualified e0 3 85 °C -40 °C 56 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 7 mm SPANSION INC TFBGA, compliant EAR99 8542.32.00.71 BGA 56