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S71PL032J40BAW070
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 256K X 16 | FLASH+PSRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | TFBGA, BGA56,8X8,32 | 56 | compliant | EAR99 | 8542.32.00.71 | ||||
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S71PL032J40BFW0K0
AMD
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Check for Price | Yes | Obsolete | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | OTHER | S-PBGA-B56 | Not Qualified | 85 °C | -25 °C | 56 | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71PL032J40BWA0K3
AMD
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Check for Price | Yes | Obsolete | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | OTHER | S-PBGA-B56 | Not Qualified | 85 °C | -25 °C | 56 | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71PL032J40BAI0K0
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 256K X 16 | FLASH+PSRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | TFBGA, BGA56,8X8,32 | 56 | compliant | EAR99 | 8542.32.00.71 | ||||
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S71PL032J40BFI0K3
AMD
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Check for Price | Yes | Obsolete | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | INDUSTRIAL | S-PBGA-B56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71PL032J40BFI0K3
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 256K X 16 | FLASH+PSRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | 56 | unknown | EAR99 | 8542.32.00.71 | ||
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S71PL032J40BWA0K2
AMD
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Check for Price | Yes | Obsolete | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | OTHER | S-PBGA-B56 | Not Qualified | 85 °C | -25 °C | 56 | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71PL032J40BFW074
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | PSEUDO STATIC RAM IS ORGANIZED AS 256K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.6 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 56 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | TFBGA, | 56 | compliant | EAR99 | 8542.32.00.71 | |||||||||
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S71PL032J40BAI072
AMD
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Check for Price | Yes | Obsolete | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+PSRAM | 5 µA | 70 µA | CMOS | INDUSTRIAL | S-PBGA-B56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
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S71PL032J40BFW072
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 256K X 16 | FLASH+PSRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | TFBGA, BGA56,8X8,32 | 56 | compliant | EAR99 | 8542.32.00.71 |