Findchips: Parametric Search Results for s71gl032n80bfw0z0


Select Parts		Part Number

		S71GL032N80BFW0K3 Spansion
		S71GL032N80BFW0P2 Cypress Semiconductor
		S71GL032N80BFW0P3 Spansion
		S71GL032N80BFW0P0 Spansion
		S71GL032N80BFW0P2 Spansion
		S71GL032N80BFW0K2 Cypress Semiconductor
		S71GL032N80BFW0K0 Spansion
		S71GL032N80BFW0K2 Spansion

				Most Relevant				Technical										Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

CYPRESS SEMICONDUCTOR CORP

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

CYPRESS SEMICONDUCTOR CORP

TFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

Compare

S71GL032N80BFW0K3

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

S71GL032N80BFW0P2

Cypress Semiconductor

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

CYPRESS SEMICONDUCTOR CORP

TFBGA,

compliant

EAR99

8542.32.00.71

S71GL032N80BFW0P3

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

S71GL032N80BFW0P0

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

S71GL032N80BFW0P2

Spansion

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

S71GL032N80BFW0K2

Cypress Semiconductor

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

CYPRESS SEMICONDUCTOR CORP

TFBGA,

compliant

EAR99

8542.32.00.71

S71GL032N80BFW0K0

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

S71GL032N80BFW0K2

Spansion

Check for Price

Yes

Transferred

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

PSRAM IS ORGANIZED AS 512K X 16

2000000

2.0972 M

ASYNCHRONOUS

3.1 V

2.7 V

CMOS

OTHER

R-PBGA-B56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

9 mm

7 mm

SPANSION INC

BGA

7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

unknown

EAR99

8542.32.00.71

Parametric results for: s71gl032n80bfw0z0 under Other Memory ICs