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S70GL02GS12FHIV23
Cypress Semiconductor
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Check for Price | Yes | Transferred | 2.1475 Gbit | 16 | 128K | 128MX16 | 3 V | 120 ns | FLASH | 8 | BOTTOM/TOP | YES | YES | YES | 1 | 2K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16/32 words | PARALLEL | 3 V | YES | 200 µA | 160 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-64 | compliant | 3A991.B.1.A | 8542.32.00.71 | |||||
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S70GL02GS12FHIV23
Spansion
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Check for Price | Yes | Transferred | 2.1475 Gbit | 16 | 128K | 128MX16 | 3 V | 120 ns | FLASH | 8 | BOTTOM/TOP | YES | YES | YES | 1 | 2K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16/32 words | PARALLEL | 3 V | YES | 200 µA | 160 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | SPANSION INC | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64 | compliant | 3A991.B.1.A | 8542.32.00.71 | BGA | 64 | |||||
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S70GL02GS12FHIV23
Infineon Technologies AG
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Check for Price | Yes | Active | 2.1475 Gbit | 16 | 128K | 128MX16 | 3 V | 120 ns | FLASH | 8 | BOTTOM/TOP | YES | YES | YES | 1 | 2K | 128000000 | 134.2177 M | ASYNCHRONOUS | 16/32 words | PARALLEL | 3 V | YES | 200 µA | 160 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | INFINEON TECHNOLOGIES AG | compliant |