Findchips: Parametric Search Results for s29pl127j60

Parametric results for: s29pl127j60 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		S29PL127J60BAI000 Cypress Semiconductor
		S29PL127J60TFW133 Cypress Semiconductor
		S29PL127J60BFI020 Cypress Semiconductor
		S29PL127J60TFW13 Cypress Semiconductor
		S29PL127J60BAW013 Spansion
		S29PL127J60TFI080 Infineon Technologies AG
		S29PL127J60BAF02 Spansion
		S29PL127J60BAW020 Cypress Semiconductor
		S29PL127J60BFI003 Spansion
		S29PL127J60TAI133 Spansion

				Most Relevant						Technical																											Compliance			Operating Conditions						Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Data Retention Time-Min	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

$11.9685

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-80

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TSSOP, TSSOP56,.8,20

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

20 X 14 MM, LEAD FREE, TSOP-56

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

100000 Write/Erase Cycles

16,254

8000000

8.3886 M

ASYNCHRONOUS

3-STATE

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

YES

NOR TYPE

60 ns

R-PDSO-G56

85 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

INFINEON TECHNOLOGIES AG

TSOP-56

compliant

Check for Price

Yes

Transferred

134.2177 Mbit

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

8000000

8.3886 M

SYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

8 X 11 MM, FBGA-80

unknown

EAR99

8542.32.00.51

BGA

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

VFBGA

BGA69,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, FBGA-64

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

11 X 8 MM, LEAD FREE, FBGA-80

unknown

EAR99

8542.32.00.51

BGA

Check for Price

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

20 X 14 MM, LEAD FREE COMPLIANT, MO-142EC, TSOP-56

not_compliant

EAR99

8542.32.00.51

TSOP1

1 2 3 4 5 Next

Compare

S29PL127J60BAI000

Cypress Semiconductor

$11.9685

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-80

compliant

EAR99

8542.32.00.51

S29PL127J60TFW133

Cypress Semiconductor

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

TSSOP, TSSOP56,.8,20

compliant

EAR99

8542.32.00.51

S29PL127J60BFI020

Cypress Semiconductor

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, LEAD FREE, FBGA-64

compliant

EAR99

8542.32.00.51

S29PL127J60TFW13

Cypress Semiconductor

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-25 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

20 X 14 MM, LEAD FREE, TSOP-56

compliant

EAR99

8542.32.00.51

S29PL127J60BAW013

Spansion

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-25 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

BGA

S29PL127J60TFI080

Infineon Technologies AG

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

100000 Write/Erase Cycles

16,254

8000000

8.3886 M

ASYNCHRONOUS

3-STATE

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

YES

NOR TYPE

60 ns

R-PDSO-G56

85 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

INFINEON TECHNOLOGIES AG

TSOP-56

compliant

S29PL127J60BAF02

Spansion

Check for Price

Yes

Transferred

134.2177 Mbit

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

8000000

8.3886 M

SYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

8 X 11 MM, FBGA-80

unknown

EAR99

8542.32.00.51

BGA

S29PL127J60BAW020

Cypress Semiconductor

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

OTHER

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

VFBGA

BGA69,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.6 mm

8 mm

CYPRESS SEMICONDUCTOR CORP

8 X 11.60 MM, FBGA-64

compliant

EAR99

8542.32.00.51

S29PL127J60BFI003

Spansion

Check for Price

Yes

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11 mm

8 mm

SPANSION INC

11 X 8 MM, LEAD FREE, FBGA-80

unknown

EAR99

8542.32.00.51

BGA

S29PL127J60TAI133

Spansion

Check for Price

Transferred

134.2177 Mbit

4K,32K

8MX16

3 V

60 ns

FLASH

TOP AND BOTTOM BOOT BLOCK

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

8 words

PARALLEL

3 V

YES

5 µA

70 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

20 X 14 MM, LEAD FREE COMPLIANT, MO-142EC, TSOP-56

not_compliant

EAR99

8542.32.00.51

TSOP1

1 2 3 4 5 Next