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S29PL032J55BFI123
Spansion
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Check for Price | Yes | Yes | Transferred | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 55 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,62 | 2000000 | 2.0972 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | 8.15 X 6.15 MM, LEAD FREE, FBGA-48 | 48 | compliant | EAR99 | 8542.32.00.51 | ||
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S29PL032J55BFI123
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 55 ns | FLASH | TOP AND BOTTOM BOOT BLOCK | BOTTOM/TOP | YES | YES | YES | 1 | 16,62 | 2000000 | 2.0972 M | ASYNCHRONOUS | 8 words | PARALLEL | 3 V | YES | 5 µA | 70 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-48 | compliant | EAR99 | 8542.32.00.51 | |||||
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S29PL032J55BFI123
AMD
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Check for Price | Transferred | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 |