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Parametric results for: s29gl064s70tfi010 under Flash Memories

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Select Parts		Part Number

		S29GL064S70TFI010 Infineon Technologies AG
		S29GL064S70TFI010 Cypress Semiconductor
		S29GL064S70TFI010 Spansion

			Most Relevant					Technical														Compliance		Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Boot Block	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	Samacsys Manufacturer	Package Description	ECCN Code	HTS Code

Yes

Active

67.1089 Mbit

8

8MX8

3 V

70 ns

FLASH

1

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PDSO-G56

e3

3

85 °C

-40 °C

260

56

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

Check for Price

Yes

Transferred

67.1089 Mbit

8

8MX8

3 V

70 ns

FLASH

BOTTOM/TOP

1

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

600 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

e3

85 °C

-40 °C

56

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

compliant

TSOP-56

3A991.B.1.A

8542.32.00.51

Check for Price

Transferred

67.1089 Mbit

8

8MX8

3 V

70 ns

FLASH

BOTTOM/TOP

1

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

85 °C

-40 °C

56

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

unknown

TSOP-56

3A991.B.1.A

8542.32.00.51

Compare

S29GL064S70TFI010

Infineon Technologies AG

Yes

Active

67.1089 Mbit

8

8MX8

3 V

70 ns

FLASH

1

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PDSO-G56

e3

3

85 °C

-40 °C

260

56

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

S29GL064S70TFI010

Cypress Semiconductor

Check for Price

Yes

Transferred

67.1089 Mbit

8

8MX8

3 V

70 ns

FLASH

BOTTOM/TOP

1

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

600 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

e3

85 °C

-40 °C

56

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

compliant

TSOP-56

3A991.B.1.A

8542.32.00.51

S29GL064S70TFI010

Spansion

Check for Price

Transferred

67.1089 Mbit

8

8MX8

3 V

70 ns

FLASH

BOTTOM/TOP

1

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

85 °C

-40 °C

56

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

unknown

TSOP-56

3A991.B.1.A

8542.32.00.51