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S25FL129P0XBHV300
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 134.2177 Mbit | 8 | 16MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 10 µA | 38 µA | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | compliant | EAR99 | 8542.32.00.51 | ||||||
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S25FL129P0XBHV300
Spansion
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Check for Price | Yes | Transferred | 134.2177 Mbit | 8 | 16MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 10 µA | 38 µA | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 105 °C | -40 °C | 260 | 40 | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | 6 X 8 MM, 1MM PITCH, HALOGEN FREE AND LEAD FREE, BGA-24 | compliant | 3A991.B.1.A | 8542.32.00.51 | BGA | 24 |