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Parametric » Sensors/Transducers » Image Sensors

Parametric results for: s10124ã under Image Sensors

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Manufacturer Part Number: s10124
Select parts from the table below to compare.
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Select Parts Part Number
S10124-512Q
 Hamamatsu Photonics
S10124-1024Q
 Hamamatsu Photonics
S10124PSI
 Applied Micro Circuits Corporation
S10124PBI
 MACOM
S10124-1024Q-01
 Hamamatsu Photonics
S10124PSI
 MACOM
S10124-512Q-01
 Hamamatsu Photonics
S10124-256Q
 Hamamatsu Photonics
S10124PBI
 Applied Micro Circuits Corporation
S10124-256Q-01
 Hamamatsu Photonics
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Rohs Code
Part Life Cycle Code
Surface Mount
Pixel Size
Horizontal Pixel
Vertical Pixel
Spectral Response (nm)
Housing
Sensors/Transducers Type
Output Type
Number of Functions
Operating Current-Max
Supply Voltage-Max
Supply Voltage-Min
Technology
JESD-609 Code
JESD-30 Code
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Array Type
Mounting Feature
Number of Terminals
Package Body Material
Package Code
Package Shape
Package Shape/Style
Package Style
Terminal Finish
Terminal Form
Terminal Position
Termination Type
Body Breadth
Body Length or Diameter
Ihs Manufacturer
Reach Compliance Code
Package Description
Supply Voltage-Nom
Telecom IC Type
Check for Price Buy
Yes Active NO 25x2500 µm 512 512 200-1000 CERAMIC IMAGE SENSOR,CMOS CURRENT OUTPUT 5.25 mA 5.25 V 4.75 V 65 °C -5 °C LINEAR THROUGH HOLE MOUNT RECTANGULAR SOLDER 10.16 mm 31.75 mm HAMAMATSU PHOTONICS KK unknown
Check for Price Buy
Yes Active NO 25x2500 µm 1024 1024 200-1000 CERAMIC IMAGE SENSOR,CMOS CURRENT OUTPUT 5.25 mA 5.25 V 4.75 V 65 °C -5 °C LINEAR THROUGH HOLE MOUNT RECTANGULAR SOLDER 10.16 mm 40.6 mm HAMAMATSU PHOTONICS KK unknown
Check for Price Buy
Yes Transferred YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM APPLIED MICRO CIRCUITS CORP compliant 25 X 25 MM, 1 MM PITCH, LEAD FREE, FBGA-576 1.2 V INTERFACE CIRCUIT
Check for Price Buy
Yes Obsolete YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM M/A-COM TECHNOLOGY SOLUTIONS INC compliant BGA, 1.2 V INTERFACE CIRCUIT
Check for Price Buy
Yes Active IMAGE SENSOR,CMOS e4 GOLD OVER NICKEL HAMAMATSU PHOTONICS KK unknown
Check for Price Buy
Yes Obsolete YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM M/A-COM TECHNOLOGY SOLUTIONS INC compliant BGA, 1.2 V INTERFACE CIRCUIT
Check for Price Buy
Yes Active IMAGE SENSOR,CMOS e4 GOLD OVER NICKEL HAMAMATSU PHOTONICS KK unknown
Check for Price Buy
Yes Active NO 25x2500 µm 256 256 200-1000 CERAMIC IMAGE SENSOR,CMOS CURRENT OUTPUT 5.25 mA 5.25 V 4.75 V 65 °C -5 °C LINEAR THROUGH HOLE MOUNT RECTANGULAR SOLDER 10.16 mm 31.75 mm HAMAMATSU PHOTONICS KK unknown
Check for Price Buy
Yes Transferred YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM APPLIED MICRO CIRCUITS CORP compliant 25 X 25 MM, 1 MM PITCH, FBGA-576 1.2 V INTERFACE CIRCUIT
Check for Price Buy
Yes Active IMAGE SENSOR,CMOS e4 GOLD OVER NICKEL HAMAMATSU PHOTONICS KK unknown
Compare
S10124-512Q
 Hamamatsu Photonics 		Check for Price Buy Yes Active NO 25x2500 µm 512 512 200-1000 CERAMIC IMAGE SENSOR,CMOS CURRENT OUTPUT 5.25 mA 5.25 V 4.75 V 65 °C -5 °C LINEAR THROUGH HOLE MOUNT RECTANGULAR SOLDER 10.16 mm 31.75 mm HAMAMATSU PHOTONICS KK unknown
S10124-1024Q
 Hamamatsu Photonics 		Check for Price Buy Yes Active NO 25x2500 µm 1024 1024 200-1000 CERAMIC IMAGE SENSOR,CMOS CURRENT OUTPUT 5.25 mA 5.25 V 4.75 V 65 °C -5 °C LINEAR THROUGH HOLE MOUNT RECTANGULAR SOLDER 10.16 mm 40.6 mm HAMAMATSU PHOTONICS KK unknown
S10124PSI
 Applied Micro Circuits Corporation 		Check for Price Buy Yes Transferred YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM APPLIED MICRO CIRCUITS CORP compliant 25 X 25 MM, 1 MM PITCH, LEAD FREE, FBGA-576 1.2 V INTERFACE CIRCUIT
S10124PBI
 MACOM 		Check for Price Buy Yes Obsolete YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM M/A-COM TECHNOLOGY SOLUTIONS INC compliant BGA, 1.2 V INTERFACE CIRCUIT
S10124-1024Q-01
 Hamamatsu Photonics 		Check for Price Buy Yes Active IMAGE SENSOR,CMOS e4 GOLD OVER NICKEL HAMAMATSU PHOTONICS KK unknown
S10124PSI
 MACOM 		Check for Price Buy Yes Obsolete YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM M/A-COM TECHNOLOGY SOLUTIONS INC compliant BGA, 1.2 V INTERFACE CIRCUIT
S10124-512Q-01
 Hamamatsu Photonics 		Check for Price Buy Yes Active IMAGE SENSOR,CMOS e4 GOLD OVER NICKEL HAMAMATSU PHOTONICS KK unknown
S10124-256Q
 Hamamatsu Photonics 		Check for Price Buy Yes Active NO 25x2500 µm 256 256 200-1000 CERAMIC IMAGE SENSOR,CMOS CURRENT OUTPUT 5.25 mA 5.25 V 4.75 V 65 °C -5 °C LINEAR THROUGH HOLE MOUNT RECTANGULAR SOLDER 10.16 mm 31.75 mm HAMAMATSU PHOTONICS KK unknown
S10124PBI
 Applied Micro Circuits Corporation 		Check for Price Buy Yes Transferred YES 1 CMOS S-PBGA-B576 NOT SPECIFIED NOT SPECIFIED 576 PLASTIC/EPOXY BGA SQUARE GRID ARRAY BALL BOTTOM APPLIED MICRO CIRCUITS CORP compliant 25 X 25 MM, 1 MM PITCH, FBGA-576 1.2 V INTERFACE CIRCUIT
S10124-256Q-01
 Hamamatsu Photonics 		Check for Price Buy Yes Active IMAGE SENSOR,CMOS e4 GOLD OVER NICKEL HAMAMATSU PHOTONICS KK unknown