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NLAS4684FCTCG
onsemi
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$0.5541 | Yes | Obsolete | 3 V | YES | 1 Ω | 60 mΩ | 60 ns | 50 ns | SPDT | CMOS | 1 | 2 | 65 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | MILITARY | R-PBGA-B10 | Not Qualified | e1 | 1 | 125 °C | -55 °C | 260 | 40 | 10 | PLASTIC/EPOXY | VFBGA | BGA10,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.965 mm | 650 µm | 1.465 mm | ONSEMI | 10 PIN FLIP-CHIP | MICROBUMP-10 | 10 | 489AA | compliant | 8542.39.00.01 | onsemi | ||
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NLAS4684FCTCG
Rochester Electronics LLC
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Check for Price | Yes | Active | 3 V | YES | 1 Ω | 60 mΩ | 60 ns | 50 ns | SPDT | CMOS | 1 | 2 | 65 dB | 5.5 V | 1.8 V | MILITARY | R-PBGA-B10 | COMMERCIAL | e3 | NOT SPECIFIED | 125 °C | -55 °C | 260 | 40 | 10 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | MATTE TIN | BALL | 500 µm | BOTTOM | 1.965 mm | 650 µm | 1.465 mm | ROCHESTER ELECTRONICS LLC | BCC | 2 X 1.50 MM, LEAD FREE, MICROBUMP-10 | 10 | MICROBUMP | unknown |