Findchips: Parametric Search Results for nand256w3a2bza6f


Select Parts		Part Number

		NAND256W3A2BZA6F STMicroelectronics
		NAND256W3A2BZA6F Micron Technology Inc
		NAND256W3A2BZA6F Numonyx Memory Solutions

				Most Relevant						Technical																				Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Command User Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

268.4355 Mbit

16K

32MX8

3 V

12 µs

FLASH

YES

32000000

33.5544 M

ASYNCHRONOUS

512 words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B55

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA55,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

10 mm

8 mm

STMICROELECTRONICS

BGA

8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-55

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

268.4355 Mbit

16K

32MX8

3 V

35 ns

FLASH

YES

32000000

33.5544 M

ASYNCHRONOUS

512 words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B55

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA55,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

10 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA55,8X12,32

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

268.4355 Mbit

16K

32MX8

3 V

12 µs

FLASH

YES

32000000

33.5544 M

ASYNCHRONOUS

512 words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B55

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA55,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

10 mm

8 mm

NUMONYX

BGA

TFBGA, BGA55,8X12,32

unknown

EAR99

8542.32.00.51

Compare

NAND256W3A2BZA6F

STMicroelectronics

Check for Price

Yes

Transferred

268.4355 Mbit

16K

32MX8

3 V

12 µs

FLASH

YES

32000000

33.5544 M

ASYNCHRONOUS

512 words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B55

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA55,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

10 mm

8 mm

STMICROELECTRONICS

BGA

8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-55

compliant

EAR99

8542.32.00.51

NAND256W3A2BZA6F

Micron Technology Inc

Check for Price

Yes

Obsolete

268.4355 Mbit

16K

32MX8

3 V

35 ns

FLASH

YES

32000000

33.5544 M

ASYNCHRONOUS

512 words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B55

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA55,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.05 mm

10 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA55,8X12,32

compliant

EAR99

8542.32.00.51

NAND256W3A2BZA6F

Numonyx Memory Solutions

Check for Price

Yes

Transferred

268.4355 Mbit

16K

32MX8

3 V

12 µs

FLASH

YES

32000000

33.5544 M

ASYNCHRONOUS

512 words

PARALLEL

3 V

YES

50 µA

20 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

SLC NAND TYPE

R-PBGA-B55

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA55,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.05 mm

10 mm

8 mm

NUMONYX

BGA

TFBGA, BGA55,8X12,32

unknown

EAR99

8542.32.00.51

Parametric results for: nand256w3a2bza6f under Flash Memories