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Manufacturer Part Number: mtfc32gjded3mwt

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	Part Number

MTFC32GJDED-3MWT

Micron Technology Inc

			Most Relevant	Technical																Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Technology	Clock Frequency-Max (fCLK)	Memory Density	Memory IC Type	Memory Width	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Organization	Parallel/Serial	Programming Voltage	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Temperature Grade	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Command User Interface	Data Polling	Toggle Bit	Type

Check for Price

Yes

Obsolete

YES

CMOS

52 MHz

274.8779 Gbit

FLASH CARD

32000000000

34.3597 G

SYNCHRONOUS

32GX8

PARALLEL

3.3 V

3.6 V

2.7 V

3.3 V

OTHER

R-PBGA-B169

85 °C

-25 °C

169

PLASTIC/EPOXY

VFBGA

BGA169,14X28,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

14 mm

18 mm

MICRON TECHNOLOGY INC

VFBGA,

compliant

EAR99

8542.32.00.51

MLC NAND TYPE

Compare

MTFC32GJDED-3MWT

Micron Technology Inc

Check for Price

Yes

Obsolete

YES

CMOS

52 MHz

274.8779 Gbit

FLASH CARD

32000000000

34.3597 G

SYNCHRONOUS

32GX8

PARALLEL

3.3 V

3.6 V

2.7 V

3.3 V

OTHER

R-PBGA-B169

85 °C

-25 °C

169

PLASTIC/EPOXY

VFBGA

BGA169,14X28,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

14 mm

18 mm

MICRON TECHNOLOGY INC

VFBGA,

compliant

EAR99

8542.32.00.51

MLC NAND TYPE