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Parametric » Telecommunication Circuits » ATM/SONET/SDH ICs

Parametric results for: mt90502ag under ATM/SONET/SDH ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		MT90502AG2 Microsemi Corporation
		MT90502AG2 Zarlink Semiconductor Inc
		MT90502AG Zarlink Semiconductor Inc
		MT90502AG Rochester Electronics LLC

				Most Relevant	Technical				Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Telecom IC Type	Applications	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

Check for Price

Obsolete

3.3 V

ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

ATM

1

COMMERCIAL

S-PBGA-B456

e1

Not Qualified

70 °C

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ZARLINK SEMICONDUCTOR INC

BGA

BGA,

456

unknown

8542.39.00.01

Check for Price

Obsolete

3.3 V

ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

ATM

1

COMMERCIAL

S-PBGA-B456

e1

Not Qualified

70 °C

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ZARLINK SEMICONDUCTOR INC

BGA,

unknown

8542.39.00.01

Check for Price

No

Obsolete

3.3 V

ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

ATM

1

COMMERCIAL

S-PBGA-B456

e0

Not Qualified

3

70 °C

225

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ZARLINK SEMICONDUCTOR INC

PLASTIC, BGA-456

compliant

8542.39.00.01

Check for Price

Yes

No

Active

3.3 V

ATM SEGMENTATION AND REASSEMBLY DEVICE

1

COMMERCIAL

S-PBGA-B456

e0

COMMERCIAL

3

70 °C

225

30

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ROCHESTER ELECTRONICS LLC

BGA

PLASTIC, BGA-456

456

unknown

Compare

Telecommunication Circuits

Microsemi Corporation

Check for Price

Obsolete

3.3 V

ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

ATM

1

COMMERCIAL

S-PBGA-B456

e1

Not Qualified

70 °C

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ZARLINK SEMICONDUCTOR INC

BGA

BGA,

456

unknown

8542.39.00.01

Zarlink Semiconductor Inc

Check for Price

Obsolete

3.3 V

ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

ATM

1

COMMERCIAL

S-PBGA-B456

e1

Not Qualified

70 °C

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ZARLINK SEMICONDUCTOR INC

BGA,

unknown

8542.39.00.01

Zarlink Semiconductor Inc

Check for Price

No

Obsolete

3.3 V

ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE

ATM

1

COMMERCIAL

S-PBGA-B456

e0

Not Qualified

3

70 °C

225

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ZARLINK SEMICONDUCTOR INC

PLASTIC, BGA-456

compliant

8542.39.00.01

Telecommunication Circuits

Rochester Electronics LLC

Check for Price

Yes

No

Active

3.3 V

ATM SEGMENTATION AND REASSEMBLY DEVICE

1

COMMERCIAL

S-PBGA-B456

e0

COMMERCIAL

3

70 °C

225

30

456

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

35 mm

35 mm

2.54 mm

ROCHESTER ELECTRONICS LLC

BGA

PLASTIC, BGA-456

456

unknown