Parametric results for: mt88l70ae under Telecom Signaling Circuits
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MT88L70AE
Microsemi Corporation
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Check for Price | No | No | Obsolete | 3 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 5.5 mA | INDUSTRIAL | R-PDIP-T18 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | MICROSEMI CORP | DIP | 18 | unknown | 8542.39.00.01 | ||||||||||
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MT88L70AE1
Microsemi Corporation
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Check for Price | Yes | Yes | Obsolete | 3 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 5.5 mA | INDUSTRIAL | R-PDIP-T18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.86 mm | 5.33 mm | MICROSEMI CORP | DIP | 18 | compliant | 8542.39.00.01 | PLASTIC, MS-001AC, DIP-18 | Microsemi Corporation | |||
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MT88L70AE
Zarlink Semiconductor Inc
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Check for Price | No | Obsolete | 3 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 5.5 mA | INDUSTRIAL | R-PDIP-T18 | e0 | Not Qualified | 85 °C | -40 °C | 260 | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.86 mm | 5.33 mm | ZARLINK SEMICONDUCTOR INC | compliant | 8542.39.00.01 | DIP, DIP18,.3 | Zarlink Semiconductor | |||||
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MT88L70AE1
Zarlink Semiconductor Inc
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Check for Price | Yes | Transferred | 3 V | CMOS | DTMF SIGNALING CIRCUIT | 1 | 5.5 mA | INDUSTRIAL | R-PDIP-T18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.86 mm | 5.33 mm | ZARLINK SEMICONDUCTOR INC | compliant | 8542.39.00.01 | PLASTIC, MS-001AC, DIP-18 | Zarlink Semiconductor |