Parametric results for: mt58l512y36p under SRAMs

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Manufacturer Part Number: mt58l512y36p
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MT58L512Y36PT-5
Rochester Electronics LLC
Check for Price Active 18.8744 Mbit 36 512KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 COMMERCIAL 70 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm ROCHESTER ELECTRONICS LLC QFP PLASTIC, TQFP-100 100 unknown
MT58L512Y36PF-10IT
Micron Technology Inc
Check for Price Obsolete MICRON TECHNOLOGY INC , unknown EAR99 8542.32.00.41
MT58L512Y36PT-5
Micron Technology Inc
Check for Price No Transferred 18.8744 Mbit 36 512KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 525 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 70 °C 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm MICRON TECHNOLOGY INC QFP PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y36PT-6
Cypress Semiconductor
Check for Price No Obsolete 18.8744 Mbit 36 512KX36 3.3 V 3.5 ns CACHE SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm CYPRESS SEMICONDUCTOR CORP QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y36PF-5
Cypress Semiconductor
Check for Price No Obsolete 18.8744 Mbit 36 512KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA TBGA, 165 compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y36PT-5
Cypress Semiconductor
Check for Price No Obsolete 18.8744 Mbit 36 512KX36 3.3 V 3.1 ns CACHE SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm CYPRESS SEMICONDUCTOR CORP QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y36PF-6
Cypress Semiconductor
Check for Price No Obsolete 18.8744 Mbit 36 512KX36 3.3 V 3.5 ns CACHE SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA TBGA, 165 unknown 3A991.B.2.A 8542.32.00.41
MT58L512Y36PF-10
Micron Technology Inc
Check for Price No Transferred 18.8744 Mbit 36 512KX36 3.3 V 5 ns 100 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 525 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 70 °C 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm MICRON TECHNOLOGY INC BGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y36PF-5
Micron Technology Inc
Check for Price No Transferred 18.8744 Mbit 36 512KX36 3.3 V 3.1 ns 200 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 10 mA 3.14 V 525 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 70 °C 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm MICRON TECHNOLOGY INC BGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
MT58L512Y36PT-6IT
Micron Technology Inc
Check for Price Obsolete MICRON TECHNOLOGY INC , unknown EAR99 8542.32.00.41