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MT58L256L36PF-7.5
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 4 ns | CACHE SRAM | PIPELINED ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | TBGA, | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||
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MT58L256L36PF-7.5
Micron Technology Inc
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Check for Price | No | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 4 ns | CACHE SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 10 mA | 3.14 V | 375 µA | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | 165 | PLASTIC/EPOXY | TBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | MICRON TECHNOLOGY INC | BGA | 13 X 15 MM, FBGA-165 | 165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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MT58L256L36PF-7.5IT
Micron Technology Inc
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Check for Price | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 4 ns | STANDARD SRAM | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 85 °C | -40 °C | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | MICRON TECHNOLOGY INC | BGA | TBGA, | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
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MT58L256L36PF-7.5IT
Cypress Semiconductor
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 4 ns | STANDARD SRAM | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | TBGA, | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||
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MT58L256L36PF-7.5
Rochester Electronics LLC
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Check for Price | Active | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 4 ns | CACHE SRAM | PIPELINED ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | CMOS | COMMERCIAL | R-PBGA-B165 | COMMERCIAL | e1 | 70 °C | 165 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 15 mm | 13 mm | ROCHESTER ELECTRONICS LLC | BGA | 13 X 15 MM, FBGA-165 | 165 | unknown |