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MT41K256M16TW-107:P
Micron Technology Inc
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MT41K256M16TW-107:P/TR
Micron Technology Inc
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Rohs Code
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Supply Voltage-Nom (Vsup)
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Self Refresh
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Technology |
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JESD-30 Code
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JESD-609 Code
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Operating Temperature-Max
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Ihs Manufacturer
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Package Description
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Yes | Active | 4.295 Gbit | 16 | 256MX16 | 1.35 V | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | MICRON TECHNOLOGY INC | FBGA-96 | not_compliant | EAR99 | 8542.32.00.36 | Micron | |||||||||||
Active | 4.295 Gbit | 16 | 256MX16 | 1.35 V | 934.5 MHz | 8192 | MULTI BANK PAGE BURST | DDR3L DRAM | COMMON | 8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 8 | 12 mA | 147 µA | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | e1 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | MICRON TECHNOLOGY INC | , | unknown | EAR99 | 8542.32.00.36 |
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MT41K256M16TW-107:P
Micron Technology Inc
|
$4.6909 Buy | Yes | Active | 4.295 Gbit | 16 | 256MX16 | 1.35 V | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | MICRON TECHNOLOGY INC | FBGA-96 | not_compliant | EAR99 | 8542.32.00.36 | Micron | ||||||||||||
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MT41K256M16TW-107:P/TR
Micron Technology Inc
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Check for Price Buy | Active | 4.295 Gbit | 16 | 256MX16 | 1.35 V | 934.5 MHz | 8192 | MULTI BANK PAGE BURST | DDR3L DRAM | COMMON | 8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 8 | 12 mA | 147 µA | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | e1 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | MICRON TECHNOLOGY INC | , | unknown | EAR99 | 8542.32.00.36 |