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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: mpc875czt66 under Microprocessors

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Select Parts		Part Number

		MPC875CZT66 Freescale Semiconductor
		KMPC875CZT66 Freescale Semiconductor
		MPC875CZT66 NXP Semiconductors

				Most Relevant						Technical								Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

No

Transferred

32

66 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e0

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-256

256

not_compliant

5A002

8542.31.00.01

Check for Price

No

Obsolete

32

66 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e0

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-256

256

not_compliant

5A002

8542.31.00.01

Check for Price

No

Obsolete

32

66 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e0

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-256

unknown

5A002.A.1

8542.31.00.01

Compare

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

No

No

Transferred

32

66 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e0

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-256

256

not_compliant

5A002

8542.31.00.01

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

No

Obsolete

32

66 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e0

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-256

256

not_compliant

5A002

8542.31.00.01

NXP Semiconductors

Check for Price

No

Obsolete

32

66 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

S-PBGA-B256

Not Qualified

e0

3

245

30

256

PLASTIC/EPOXY

HBGA

BGA256,16X16,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.54 mm

23 mm

23 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-256

unknown

5A002.A.1

8542.31.00.01