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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: mpc859pzp133a under Microprocessors

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Select Parts		Part Number

		MPC859PZP133A Freescale Semiconductor
		MPC859PZP133A NXP Semiconductors

				Most Relevant						Technical									Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

No

Transferred

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

e0

3

95 °C

220

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-357

357

not_compliant

3A991.A.2

8542.31.00.01

Check for Price

No

Obsolete

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

e0

3

95 °C

220

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01

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Microcontrollers and Processors

Freescale Semiconductor

Check for Price

No

No

Transferred

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

e0

3

95 °C

220

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

PLASTIC, BGA-357

357

not_compliant

3A991.A.2

8542.31.00.01

NXP Semiconductors

Check for Price

No

Obsolete

32

133 MHz

32

32

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

e0

3

95 °C

220

30

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

25 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01