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MLG1608B3N9ST
TDK Corporation
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Check for Price | Yes | Yes | Obsolete | GENERAL PURPOSE INDUCTOR | 3.9 nH | 140 mΩ | 7.693 % | YES | 100 MHz | 600 mA | 6 GHz | CERAMIC | 10 | 0603 | RF INDUCTOR | 1 | NO | INDUCTANCE TOLERANCE IS 0.3 NANO HENRY | e1 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | Tin/Silver/Copper (Sn/Ag/Cu) | DUAL ENDED | WRAPAROUND | TDK CORP | CHIP, 0603, HALOGEN FREE AND ROHS COMPLIANT | compliant | EAR99 | 8504.50.80.00 | TDK | ||||||||||
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MLG1608B3N9S
TDK Corporation
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Check for Price | Yes | Obsolete | GENERAL PURPOSE INDUCTOR | 3.9 nH | 200 mΩ | 7.693 % | YES | 100 MHz | 300 mA | 5.6 GHz | CERAMIC | 10 | RF INDUCTOR | 1 | NO | INDUCTANCE TOLERANCE IS 0.3 NANO HENRY | 85 °C | -25 °C | 2 | RECTANGULAR PACKAGE | DUAL ENDED | WRAPAROUND | TDK CORP | compliant | EAR99 | 8504.50.80.00 | TDK | |||||||||||||||
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MLG1608B3N9STD25
TDK Corporation
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Check for Price | Obsolete | GENERAL PURPOSE INDUCTOR | 3.9 nH | 140 mΩ | 7.6923 % | YES | 100 MHz | 600 mA | 6 GHz | Ceramic | 10 | 0603 | MLG | RF INDUCTOR | 1 | NO | AEC-Q200 | 125 °C | -55 °C | Rectangular | 2 | SMT | TR, PUNCHED PAPER, 7 INCH | RECTANGULAR PACKAGE | DUAL ENDED | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | unknown | EAR99 | 8504.50.80.00 | TDK | ||||||||
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MLG1608B3N9ST000
TDK Corporation
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Check for Price | Yes | Yes | Obsolete | GENERAL PURPOSE INDUCTOR | 3.9 nH | 140 mΩ | 7.693 % | YES | 100 MHz | 600 mA | 6 GHz | Ferrite | 10 | 1608 | RF INDUCTOR | 1 | NO | INDUCTANCE TOLERANCE IS 0.3 NANO HENRY | e3 | 125 °C | -55 °C | Multilayer Chip | 2 | SMT | TR, 7 Inch | RECTANGULAR PACKAGE | TIN | DUAL ENDED | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP, 1608, ROHS COMPLIANT | compliant | EAR99 | 8504.50.80.00 | TDK |