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ML5824EM
RF Micro Devices Inc
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Check for Price | Transferred | 3.2 V | TELECOM CIRCUIT | 1 | COMMERCIAL | R-PQCC-N28 | Not Qualified | 70 °C | -10 °C | 28 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 5 mm | 1 mm | SIRENZA MICRODEVICES INC | QFN | HVQCCN, | 28 | unknown | 8542.39.00.01 | ||
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ML5824EM-T
RF Micro Devices Inc
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Check for Price | Transferred | 3.2 V | TELECOM CIRCUIT | 1 | COMMERCIAL | R-PQCC-N28 | Not Qualified | 70 °C | -10 °C | 28 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 5 mm | 1 mm | SIRENZA MICRODEVICES INC | QFN | HVQCCN, | 28 | unknown | 8542.39.00.01 |