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Parametric » Power Circuits » Power Management Circuits

Parametric results for: mcz33903dp5ek under Power Management Circuits

Select parts from the table below to compare.

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Select Parts		Part Number

		MCZ33903DP5EKR2 NXP Semiconductors
		MCZ33903DP5EK NXP Semiconductors

			Most Relevant						Technical				Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Active

10.5 V

5.5 V

28 V

1

YES

YES

SYSTEM BASIS CHIP

1

MOS

AUTOMOTIVE

R-PDSO-G32

e3

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

SOIC-32

compliant

EAR99

8542.39.00.01

NXP

Yes

Active

10.5 V

5.5 V

28 V

1

YES

YES

SYSTEM BASIS CHIP

1

MOS

AUTOMOTIVE

R-PDSO-G32

e3

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

SOIC-32

compliant

EAR99

8542.39.00.01

NXP

Compare

MCZ33903DP5EKR2

NXP Semiconductors

Yes

Active

10.5 V

5.5 V

28 V

1

YES

YES

SYSTEM BASIS CHIP

1

MOS

AUTOMOTIVE

R-PDSO-G32

e3

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

SOIC-32

compliant

EAR99

8542.39.00.01

NXP

NXP Semiconductors

Yes

Active

10.5 V

5.5 V

28 V

1

YES

YES

SYSTEM BASIS CHIP

1

MOS

AUTOMOTIVE

R-PDSO-G32

e3

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SOP32,.4,25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

SOIC-32

compliant

EAR99

8542.39.00.01

NXP