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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: mc8640tvj1067ne under Microprocessors

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Select Parts		Part Number

		MC8640TVJ1067NE NXP Semiconductors
		MC8640TVJ1067NE Freescale Semiconductor

				Most Relevant							Technical										Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Number of DMA Channels	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Yes

Obsolete

32

1.067 GHz

32

32

166.66 MHz

YES

950 mV

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

NO

4

1 V

900 mV

INDUSTRIAL

S-CBGA-B1023

e2

3

105 °C

-40 °C

245

30

1023

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.77 mm

33 mm

33 mm

NXP SEMICONDUCTORS

FCBGA-1023

compliant

3A991.A.1

8542.31.00.01

NXP

Check for Price

Yes

Yes

Transferred

32

1.067 GHz

64

16

YES

950 mV

MICROPROCESSOR

CMOS

YES

FLOATING POINT

YES

YES

1 V

900 mV

INDUSTRIAL

S-CBGA-B1023

e2

3

105 °C

-40 °C

1023

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1 mm

BOTTOM

2.77 mm

33 mm

33 mm

FREESCALE SEMICONDUCTOR INC

FCBGA-1023

compliant

3A991.A.1

8542.31.00.01

NXP

Compare

MC8640TVJ1067NE

NXP Semiconductors

Yes

Obsolete

32

1.067 GHz

32

32

166.66 MHz

YES

950 mV

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

NO

4

1 V

900 mV

INDUSTRIAL

S-CBGA-B1023

e2

3

105 °C

-40 °C

245

30

1023

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.77 mm

33 mm

33 mm

NXP SEMICONDUCTORS

FCBGA-1023

compliant

3A991.A.1

8542.31.00.01

NXP

MC8640TVJ1067NE

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

32

1.067 GHz

64

16

YES

950 mV

MICROPROCESSOR

CMOS

YES

FLOATING POINT

YES

YES

1 V

900 mV

INDUSTRIAL

S-CBGA-B1023

e2

3

105 °C

-40 °C

1023

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1 mm

BOTTOM

2.77 mm

33 mm

33 mm

FREESCALE SEMICONDUCTOR INC

FCBGA-1023

compliant

3A991.A.1

8542.31.00.01

NXP