Parametric results for: mc8640hx1250h under Microprocessors

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Manufacturer Part Number: mc8640hx1250h
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MC8640HX1250HC
NXP Semiconductors
Check for Price Obsolete NXP SEMICONDUCTORS unknown
MC8640HX1250HC
Freescale Semiconductor
Check for Price No Obsolete 32 1.25 GHz 32 32 166.66 MHz YES 1.05 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.1 V 1 V OTHER S-CBGA-B1023 Not Qualified e0 3 105 °C 245 30 1023 CERAMIC, METAL-SEALED COFIRED BGA SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.97 mm 33 mm 33 mm FREESCALE SEMICONDUCTOR INC not_compliant BGA 33 X 33 MM, CERAMIC, FCBGA-1023 1023 3A991 8542.31.00.01
MC8640HX1250HE
NXP Semiconductors
Check for Price No Obsolete 32 1.25 GHz 32 32 166.66 MHz YES 1.05 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES NO 4 1.1 V 1 V OTHER S-CBGA-B1023 Not Qualified e0 3 105 °C 245 30 1023 CERAMIC HBGA BGA1023,32X32,40 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.97 mm 33 mm 33 mm NXP SEMICONDUCTORS unknown HBGA, BGA1023,32X32,40 3A991.A.1 8542.31.00.01
MC8640HX1250HE
Freescale Semiconductor
Check for Price No No Transferred 32 1.25 GHz 32 32 166.66 MHz YES 1.05 V MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1.1 V 1 V OTHER S-CBGA-B1023 Not Qualified e0 3 105 °C 245 30 1023 CERAMIC, METAL-SEALED COFIRED BGA BGA1023,32X32,40 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 2.97 mm 33 mm 33 mm FREESCALE SEMICONDUCTOR INC not_compliant BGA 33 X 33 MM, CERAMIC, FCBGA-1023 1023 3A991.A.1 8542.31.00.01