Findchips: Parametric Search Results for mc68en360vr25vl


Select Parts		Part Number

		MC68EN360VR25VL NXP Semiconductors
		MC68EN360VR25VL Freescale Semiconductor

				Most Relevant										Technical															Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	RAM (words)	Bus Compatibility	External Data Bus Width	Address Bus Width	Data Transfer Rate-Max	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Communication Protocol	Data Encoding/Decoding Method	Format	Integrated Cache	Low Power Mode	Number of DMA Channels	Number of Serial I/Os	On Chip Data RAM Width	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$105.0620

Yes

Obsolete

2560

SCC, SMC, SPI, UART

1.25 MBps

33.34 MHz

YES

5 V

SERIAL IO/COMMUNICATION CONTROLLER, LAN

HCMOS

ALSO OPERATES AT 3.3 V

YES

ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC

NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER)

YES

5.25 V

4.75 V

COMMERCIAL

S-PBGA-B357

Not Qualified

70 °C

260

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

NXP SEMICONDUCTORS

BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Transferred

33 MHz

33.34 MHz

YES

5 V

MICROPROCESSOR, RISC

HCMOS

ALSO OPERATES AT 3.3 V

YES

FLOATING POINT

YES

5.25 V

4.75 V

COMMERCIAL

S-PBGA-B357

Not Qualified

70 °C

260

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

257

Compare

MC68EN360VR25VL

NXP Semiconductors

$105.0620

Yes

Obsolete

2560

SCC, SMC, SPI, UART

1.25 MBps

33.34 MHz

YES

5 V

SERIAL IO/COMMUNICATION CONTROLLER, LAN

HCMOS

ALSO OPERATES AT 3.3 V

YES

ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC

NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL(MANCHESTER)

YES

5.25 V

4.75 V

COMMERCIAL

S-PBGA-B357

Not Qualified

70 °C

260

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

NXP SEMICONDUCTORS

BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

MC68EN360VR25VL

Freescale Semiconductor

Check for Price

Yes

Transferred

33 MHz

33.34 MHz

YES

5 V

MICROPROCESSOR, RISC

HCMOS

ALSO OPERATES AT 3.3 V

YES

FLOATING POINT

YES

5.25 V

4.75 V

COMMERCIAL

S-PBGA-B357

Not Qualified

70 °C

260

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

BGA

257

Parametric results for: mc68en360vr25vl under Microprocessors