Findchips.com

Register or Sign In

Parametric » Telecommunication Circuits » Network Interfaces

Parametric results for: mc34905cs3ekr2 under Network Interfaces

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		MC34905CS3EKR2 NXP Semiconductors
		MC34905CS3EK/R2 NXP Semiconductors
		MC34905CS3EKR2 Freescale Semiconductor

				Most Relevant				Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Number of Transceivers	Data Rate	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	ECCN Code

Yes

Obsolete

3.3 V

CMOS

1

1 Gbps

SUPPORT CIRCUIT

1

8 µA

AUTOMOTIVE

R-PDSO-G32

e3

Not Qualified

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

HSSOP, SSOP32,.4

compliant

8542.39.00.01

Check for Price

Yes

Obsolete

3.3 V

CMOS

1

1 Gbps

SUPPORT CIRCUIT

1

8 µA

AUTOMOTIVE

R-PDSO-G32

e3

Not Qualified

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

HSSOP, SSOP32,.4

compliant

8542.39.00.01

Check for Price

Yes

Yes

Transferred

3.3 V

SUPPORT CIRCUIT

1

AUTOMOTIVE

R-PDSO-G32

e3

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

8542.39.00.01

EAR99

Compare

NXP Semiconductors

Yes

Obsolete

3.3 V

CMOS

1

1 Gbps

SUPPORT CIRCUIT

1

8 µA

AUTOMOTIVE

R-PDSO-G32

e3

Not Qualified

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

HSSOP, SSOP32,.4

compliant

8542.39.00.01

MC34905CS3EK/R2

NXP Semiconductors

Check for Price

Yes

Obsolete

3.3 V

CMOS

1

1 Gbps

SUPPORT CIRCUIT

1

8 µA

AUTOMOTIVE

R-PDSO-G32

e3

Not Qualified

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

NXP SEMICONDUCTORS

HSSOP, SSOP32,.4

compliant

8542.39.00.01

Telecommunication Circuits

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

3.3 V

SUPPORT CIRCUIT

1

AUTOMOTIVE

R-PDSO-G32

e3

3

125 °C

-40 °C

260

40

32

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

7.5 mm

11 mm

2.45 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

8542.39.00.01

EAR99