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MC-242453F9-B90-BS1
NEC Electronics Group
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Check for Price | Obsolete | 33.5544 Mbit | 16 | 2MX16 | MEMORY CIRCUIT | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3 V | 2.6 V | CMOS | COMMERCIAL | R-PBGA-B71 | Not Qualified | 70 °C | -20 °C | 71 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.21 mm | 11 mm | 7 mm | NEC ELECTRONICS CORP | BGA | LFBGA, | 71 | unknown | EAR99 | 8542.32.00.71 | |||||||
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MC-242453F9-B10-BT3
NEC Electronics Group
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Check for Price | Obsolete | 33.5544 Mbit | 16 | 2MX16 | MEMORY CIRCUIT | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3 V | 2.6 V | CMOS | COMMERCIAL | R-PBGA-B77 | Not Qualified | 70 °C | -20 °C | 77 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 7 mm | NEC ELECTRONICS CORP | BGA | TFBGA, | 77 | unknown | EAR99 | 8542.32.00.71 | |||||||
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MC-242453F9-B95-BS1
NEC Electronics Group
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Check for Price | Obsolete | 33.5544 Mbit | 16 | 2MX16 | MEMORY CIRCUIT | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3 V | 2.6 V | CMOS | COMMERCIAL | R-PBGA-B71 | Not Qualified | 70 °C | -20 °C | 71 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.21 mm | 11 mm | 7 mm | NEC ELECTRONICS CORP | BGA | LFBGA, | 71 | unknown | EAR99 | 8542.32.00.71 | |||||||
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MC-242453F9-B90-BT3
Renesas Electronics Corporation
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Check for Price | Obsolete | 90 ns | MEMORY CIRCUIT | FLASH+SRAM | 10 µA | 45 µA | HYBRID | COMMERCIAL | R-PBGA-B77 | Not Qualified | 70 °C | -20 °C | 77 | PLASTIC/EPOXY | FBGA | BGA77,8X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | RENESAS ELECTRONICS CORP | FBGA, BGA77,8X14,32 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||
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MC-242453F9-B10-BS1
Renesas Electronics Corporation
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Check for Price | Obsolete | 100 ns | MEMORY CIRCUIT | FLASH+SRAM | 10 µA | 45 µA | HYBRID | COMMERCIAL | R-PBGA-B77 | Not Qualified | 70 °C | -20 °C | 77 | PLASTIC/EPOXY | FBGA | BGA77,8X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | RENESAS ELECTRONICS CORP | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||
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MC-242453F9-B10-BT3
Renesas Electronics Corporation
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Check for Price | Obsolete | 100 ns | MEMORY CIRCUIT | FLASH+SRAM | 10 µA | 45 µA | HYBRID | COMMERCIAL | R-PBGA-B77 | Not Qualified | 70 °C | -20 °C | 77 | PLASTIC/EPOXY | FBGA | BGA77,8X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | RENESAS ELECTRONICS CORP | FBGA, BGA77,8X14,32 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||||
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MC-242453F9-B90-BS1
Renesas Electronics Corporation
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Check for Price | Obsolete | 80 ns | MEMORY CIRCUIT | FLASH+SRAM | 10 µA | 45 µA | HYBRID | COMMERCIAL | R-PBGA-B77 | Not Qualified | 70 °C | -20 °C | 77 | PLASTIC/EPOXY | FBGA | BGA77,8X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | RENESAS ELECTRONICS CORP | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||
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MC-242453F9-B95-BT3
NEC Electronics Group
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Check for Price | Obsolete | 33.5544 Mbit | 16 | 2MX16 | MEMORY CIRCUIT | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3 V | 2.6 V | CMOS | COMMERCIAL | R-PBGA-B77 | Not Qualified | 70 °C | -20 °C | 77 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 7 mm | NEC ELECTRONICS CORP | BGA | TFBGA, | 77 | unknown | EAR99 | 8542.32.00.71 | |||||||
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MC-242453F9-B10-BS1
NEC Electronics Group
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Check for Price | Obsolete | 33.5544 Mbit | 16 | 2MX16 | MEMORY CIRCUIT | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3 V | 2.6 V | CMOS | COMMERCIAL | R-PBGA-B71 | Not Qualified | 70 °C | -20 °C | 71 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.21 mm | 11 mm | 7 mm | NEC ELECTRONICS CORP | BGA | LFBGA, | 71 | unknown | EAR99 | 8542.32.00.71 | |||||||
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MC-242453F9-B90-BT3
NEC Electronics Group
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Check for Price | Obsolete | 33.5544 Mbit | 16 | 2MX16 | MEMORY CIRCUIT | THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3 V | 2.6 V | CMOS | COMMERCIAL | R-PBGA-B77 | Not Qualified | 70 °C | -20 °C | 77 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 7 mm | NEC ELECTRONICS CORP | BGA | TFBGA, | 77 | unknown | EAR99 | 8542.32.00.71 |