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Parametric results for: mbm29dl324td-80pbt under Flash Memories

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Manufacturer Part Number: mbm29dl324td80pbt
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MBM29DL324TD80PBT
 FUJITSU Limited 		Check for Price Transferred 33.5544 Mbit 16 2MX16 3.3 V 80 ns FLASH 8 TOP 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS COMMERCIAL NOR TYPE R-PBGA-B57 Not Qualified 70 °C -20 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU SEMICONDUCTOR AMERICA INC BGA TFBGA, 57 unknown EAR99 8542.32.00.51
MBM29DL324TD80PBT
 FUJITSU Semiconductor Limited 		Check for Price Transferred 33.5544 Mbit 16 2MX16 3.3 V 80 ns FLASH 8 TOP 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS COMMERCIAL NOR TYPE R-PBGA-B57 Not Qualified 70 °C -20 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU SEMICONDUCTOR AMERICA INC PLASTIC, FBGA-57 unknown EAR99 8542.32.00.51
MBM29DL324TD-80PBT
 FUJITSU Semiconductor Limited 		Check for Price No Obsolete 33.5544 Mbit 8 8K,64K 4MX8 3.3 V 80 ns FLASH CONFIGURABLE AS 2M X 16 8 TOP YES YES YES 1 8,63 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 53 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B57 Not Qualified e0 70 °C -20 °C 57 PLASTIC/EPOXY TFBGA BGA56,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU LTD BGA TFBGA, BGA56,8X12,32 57 unknown EAR99 8542.32.00.51
MBM29DL324TD-80PBT
 FUJITSU Limited 		Check for Price No Obsolete 33.5544 Mbit 8 8K,64K 4MX8 3.3 V 80 ns FLASH CONFIGURABLE AS 2M X 16 8 TOP YES YES YES 1 8,63 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 53 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B57 Not Qualified e0 70 °C -20 °C 57 PLASTIC/EPOXY TFBGA BGA56,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm FUJITSU LTD PLASTIC, FBGA-57 unknown EAR99 8542.32.00.51
MBM29DL324TD80PBT
 Spansion 		Check for Price No Obsolete 33.5544 Mbit 16 2MX16 3.3 V 80 ns FLASH 8 TOP 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS COMMERCIAL NOR TYPE R-PBGA-B57 Not Qualified e0 70 °C -20 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm SPANSION INC BGA PLASTIC, FBGA-57 57 compliant EAR99 8542.32.00.51
MBM29DL324TD80PBT-E1
 Spansion 		Check for Price Yes Obsolete 33.5544 Mbit 16 2MX16 3.3 V 80 ns FLASH 8 TOP 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS COMMERCIAL NOR TYPE R-PBGA-B57 Not Qualified e1 70 °C -20 °C 57 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13.95 mm 7.95 mm SPANSION INC BGA PLASTIC, FBGA-57 57 compliant EAR99 8542.32.00.51