Parametric results for: max9890bebl under Other Consumer ICs

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Manufacturer Part Number: max9890bebl
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MAX9890BEBL+
Maxim Integrated Products
Check for Price Yes Transferred HVSON CONSUMER CIRCUIT BICMOS 1 5.5 V 2.7 V INDUSTRIAL S-PDSO-N8 e1 1 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES TIN SILVER COPPER NO LEAD 650 µm DUAL 3 mm 3 mm 800 µm MAXIM INTEGRATED PRODUCTS INC 3 X 3 MM, 0.80 MM HEIGHT, MO229, TDFN-8 compliant EAR99 8542.39.00.01
MAX9890BEBL-T
Maxim Integrated Products
Check for Price No No Obsolete VFBGA CONSUMER CIRCUIT BICMOS 1 22 µA 5.5 V 2.7 V INDUSTRIAL S-PBGA-B9 Not Qualified e0 1 85 °C -40 °C 9 PLASTIC/EPOXY BGA9,3X3,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 500 µm BOTTOM 1.52 mm 1.52 mm 690 µm MAXIM INTEGRATED PRODUCTS INC 1.50 X 1.50 MM, UCSP-9 not_compliant 8542.39.00.01 BGA 9
MAX9890BEBL+TG29
Maxim Integrated Products
Check for Price Obsolete CONSUMER CIRCUIT e1 1 260 30 TIN SILVER COPPER MAXIM INTEGRATED PRODUCTS INC , unknown 8542.39.00.01
MAX9890BEBL+T
Analog Devices Inc
Check for Price Yes Active VFBGA CONSUMER CIRCUIT BICMOS 1 22 µA 5.5 V 2.7 V INDUSTRIAL S-PBGA-B9 Not Qualified e1 1 85 °C -40 °C 260 30 9 PLASTIC/EPOXY BGA9,3X3,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.52 mm 1.52 mm 690 µm ANALOG DEVICES INC UCSP-9 compliant N/A 9 N/A 2003-08-18 Analog Devices
MAX9890BEBL+
Analog Devices Inc
Check for Price Yes Active HVSON CONSUMER CIRCUIT BICMOS 1 5.5 V 2.7 V INDUSTRIAL S-PDSO-N8 e1 1 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) NO LEAD 650 µm DUAL 3 mm 3 mm 800 µm ANALOG DEVICES INC 3 X 3 MM, 0.80 MM HEIGHT, MO229, TDFN-8 compliant N/A 9 N/A 2003-08-18 Analog Devices
MAX9890BEBL+T
Maxim Integrated Products
Check for Price Yes Yes Transferred VFBGA CONSUMER CIRCUIT BICMOS 1 22 µA 5.5 V 2.7 V INDUSTRIAL S-PBGA-B9 Not Qualified e1 1 85 °C -40 °C 260 30 9 PLASTIC/EPOXY BGA9,3X3,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1.52 mm 1.52 mm 690 µm MAXIM INTEGRATED PRODUCTS INC UCSP-9 compliant EAR99 8542.39.00.01 BGA 9