Parametric results for: max6782tea+ under Power Management Circuits
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MAX6782TEA+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 1.6 V | 1.2 V | 5.5 V | 10 µA | 4 | YES | NO | POWER SUPPLY SUPPORT CIRCUIT | 1 | BICMOS | INDUSTRIAL | S-XQCC-N16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | ROHS COMPLIANT, TQFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | ||
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MAX6782TEA+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 1.6 V | 1.2 V | 5.5 V | 10 µA | 4 | YES | NO | POWER SUPPLY SUPPORT CIRCUIT | 1 | BICMOS | INDUSTRIAL | S-XQCC-N16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 |